蓝宝石高效低损伤加工工艺研究

发布时间：2018-03-23 15:09

本文选题：蓝宝石　切入点：固结磨料研磨技术　出处：《大连理工大学》2015年硕士论文

【摘要】：单晶蓝宝石是一种多功能晶体材料,除具有优良的物理性能、化学性能和光学性外,其还具有透光性好,熔点高,硬度高,电绝缘性优良,热传导性良好,化学性能稳定等特性,在国防、超导、光电子、微电子等领域具有广泛的应用。无论是用于国防领域的红外探测器的蓝宝石窗口,还是用于LED行业的蓝宝石基片,对蓝宝石的加工精度(面型精度、尺寸精度等)和加工表面完整性提出了很高的要求。传统游离磨料研磨、化学机械抛光蓝宝石加工工艺,其加工效率低,加工成本高,加工精度不稳定,很难实现自动化等缺点制约了蓝宝石晶体加工技术的发展。因此,研究和开发一种新型高效低损伤蓝宝石加工工艺尤为重要。本文以提高加工后蓝宝石表面质量和缩短加工时间为目标,提出采用固结金刚石研磨盘粗磨获得所需的尺寸精度和面型精度,采用机械化学抛光盘抛光获得超光滑表面。论文主要研究内容如下：(1)在游离磨料研磨的基础上提出采用固结金刚石研磨盘研磨技术对蓝宝石进行加工,分析了固结金刚石研磨盘加工原理以及修整方法。对固结金刚石研磨盘技术进行了探索,以加工后蓝宝石的表面质量和材料去除率作为衡量标准,对比了不同结合剂、不同磨料粒度金刚石研磨盘的研磨性能。(2)采用截面显微法和角度抛光法对固结金刚石研磨盘加工后的蓝宝石亚表面损伤层进行检测。总结裂纹类型,分析亚表面裂纹成型原因。探索固结金刚石研磨技术中,磨料粒径与蓝宝石亚表面损伤层深度之间的关系。(3)针对传统蓝宝石平坦化CMP技术不足,提出固结磨料机械化学抛光技术,通过化学和机械共同作用达到去除材料的目的。针对蓝宝石的物理化学特性,研制了蓝宝石专用的机械化学抛光盘并提出了专用修整方法。采用恒压力研磨机为工作平台,对机械化学抛光盘进行实验验证。(4)将固结金刚石磨盘研磨技术与固结磨料机械化学抛光技术相集成,设计了一种高效低损伤的蓝宝石加工工艺：采用W20固结金刚石研磨盘粗磨,去除加工余量,获得所需尺寸精度；然后采用W7固结金刚石研磨盘精磨,提高面型精度和表面质量,降低加工后的亚表面损伤层深度；最后采用机械化学抛光盘对蓝宝石进行抛光,去除由金刚石研磨盘加工带入的亚表面损伤,获得光滑的蓝宝石表面质量。
[Abstract]:Single crystal sapphire is a kind of multifunctional crystal material. In addition to its excellent physical, chemical and optical properties, it also has good transmittance, high melting point, high hardness, excellent electrical insulation and good thermal conductivity. Chemical stability has been widely used in the fields of national defense, superconducting, optoelectronics, microelectronics and so on. Whether it is used in the sapphire window of infrared detectors in the field of national defense or in the sapphire substrate of the LED industry, The machining accuracy (surface precision, dimension precision, etc.) and the surface integrity of sapphire are very high. The traditional free abrasive grinding and chemical mechanical polishing sapphire processing technology have low processing efficiency and high processing cost. The development of sapphire crystal processing technology is restricted by the instability of machining precision and the difficulty of automating. It is very important to study and develop a new high efficiency and low damage sapphire processing technology. The aim of this paper is to improve the surface quality and shorten the processing time of sapphire. In this paper, the size accuracy and surface shape accuracy are obtained by rough grinding of consolidated diamond grinding disc. The super-smooth surface is obtained by mechanochemical polishing of optical disk. The main contents of this paper are as follows: (1) on the basis of free abrasive grinding, a new technique of grinding sapphire with consolidated diamond lapping disk is proposed. The machining principle and dressing method of bonded diamond abrasive disc are analyzed. The technology of consolidated diamond grinding disc is explored. The surface quality and material removal rate of sapphire after processing are taken as the measurement standard, and the different binders are compared. The abrasive properties of diamond lapping discs with different abrasive sizes. (2) using cross section microscopy and angle polishing method to detect the subsurface damage layer of sapphire after processing of bonded diamond lapping disc. The types of cracks are summarized. This paper analyzes the causes of subsurface crack forming, explores the relationship between abrasive particle size and the depth of sapphire subsurface damage layer in the grinding technology of consolidated diamond, and aims at the shortage of traditional sapphire flattening CMP technology. This paper puts forward the technology of mechanical chemical polishing of consolidated abrasive, which can remove the material by chemical and mechanical interaction. The physical and chemical properties of sapphire are discussed. A special mechanochemical polishing disc for sapphire was developed and a special dressing method was put forward. The constant pressure grinder was used as the working platform. An experimental verification of mechanochemical polishing disc is made. (4) the grinding technology of consolidated diamond disc is integrated with the mechanical chemical polishing technology of consolidated abrasive material, and a high efficiency and low damage sapphire processing technology is designed: the rough grinding of W20 consolidated diamond grinding disk is adopted. The machining allowance is removed to obtain the required dimension precision, and then the W7 consolidated diamond grinding disk is used to improve the surface shape accuracy and surface quality, and to reduce the depth of the damaged subsurface layer after processing. Finally, the sapphire was polished by mechanochemical polishing disc to remove the sub-surface damage caused by diamond grinding disc, and the smooth sapphire surface quality was obtained.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ164.2

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