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氢氧化钠替代氨水调节pH值对镍钨电镀的影响

发布时间:2018-10-23 14:19
【摘要】:为延长碱性镍钨合金电镀液的使用周期,在定时定量补加其他组分的前提下,采用氢氧化钠部分替代氨水补加来调节镀液pH值,与氨水补加方式进行比较,考察了2种补加方式下镀液的使用周期、试片硬度和耐盐水腐蚀性能。结果显示:前者可以使镀液的使用周期延长约1倍。对2组试片的失重量、维氏硬度和镀速进行配对T检验,耐盐水腐蚀性能基本不变(P=0.549,0.050,无显著差异),镀层硬度略有提高,镀速降低(P=0,0.050,有显著差异),具有生产指导意义。
[Abstract]:In order to prolong the service cycle of alkaline nickel-tungsten alloy electroplating solution, sodium hydroxide was used to partially replace ammonia solution to adjust the pH value of plating solution under the premise of regular and quantitative addition of other components. The life cycle, hardness and corrosion resistance of the plating bath were investigated. The results show that the former can prolong the service life of the bath by about twice. The weight loss, Vickers hardness and plating rate of the two groups were tested by paired T test. The corrosion resistance of the two groups was basically unchanged (P0. 549% 0.050, there was no significant difference), the hardness of the coating increased slightly and the plating rate decreased (P0. 0- 0. 050, there was significant difference), which was of guiding significance in production.
【作者单位】: 长沙医学院化学教研室;湖南纳菲尔新材料科技股份有限公司;
【基金】:湖南省教育厅科学研究项目(16C0152)资助
【分类号】:TQ153.2

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