新型无氰镀镉工艺的研究与应用

发布时间：2019-03-02 16:12

【摘要】：引进了新型无氰氯化钾镀镉工艺,在实验室和生产线上对其工艺性能和镀层性能进行了研究。镀液组成为35~40 g/L氯化镉,140~180 g/L氯化钾,120~160 g/L配位剂,25~35 m L/L辅助剂,1.5~2.5 m L/L光亮剂,p H为6.0~7.0,挂镀JΚ为0.5~1.5 A/dm2,θ为15~35℃;滚镀槽电压4~7 V,θ为15~30℃,滚筒转速3~7 r/min。在JΚ为1 A/dm2下电镀,镉的沉积速率为0.23μm/min,电流效率为72.3%。镀层经过低铬彩色钝化后进行中性盐雾试验96 h无白锈生成,504 h无红锈生成,其耐蚀性高于氰化镀镉。实验表明,该镀液的均镀能力和深镀能力、镀层的氢脆性和耐蚀性、结合力均满足HB 5036-92《镉镀层质量检验》的要求,废水处理后镉离子满足GB21900-2008《电镀污染物排放标准》的要求。
[Abstract]:A new process of cadmium plating with cyanide-free potassium chloride was introduced and its technological properties and coating properties were studied in laboratory and production line. The plating solution consists of 35 ~ 40 g / L cadmium chloride, 140 ~ 180 g / L potassium chloride, 120 / 160 g / L ligand, 25 / 35 / L auxiliary aid, 1.5 / 2.5 / L brightener, p H = 6.0 / 7.0, and on-plating J-K = 0.5 / 1.5 / L / m ~ (2). 胃 = 15 ~ 35 鈩，

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