SPDT加工对KDP晶体表面温度及应力的影响

发布时间：2018-06-24 03:58

  本文选题：KDP晶体 + 温度原位测量　； 参考：《人工晶体学报》2016年04期

【摘要】：KDP晶体作为优质的非线性光学材料,具有脆性高、对温度敏感等特性,在单点金刚石切削(SPDT)超精密加工中,微小的温度和应力变化有可能对晶体造成损伤,但是一直未有相关实验报道。本文采用红外热成像仪对SPDT加工过程进行监测,结合Raman光谱技术,研究KDP晶体在SPDT加工前后表面温度和应力的分布变化。大尺寸KDP晶体经过快速微区切削后,在给定的切削工艺条件下,测量出切削部分最高瞬态温度比附近未切削部分高出将近8℃。通过Raman测量,显示切削后晶体表面存在残余拉应力。结合热力耦合模拟仿真,进一步分析了SPDT加工过程动态切削温度对晶体质量的影响,为优化加工参数提供依据。
[Abstract]:As a high quality nonlinear optical material, KDP crystal has the characteristics of high brittleness and sensitivity to temperature. In the ultra-precision machining of single point diamond cutting (SPDT), the tiny changes of temperature and stress may cause damage to the crystal. However, there have been no related experimental reports. In this paper, infrared thermal imager is used to monitor the processing process of SPDT, and Raman spectroscopy is used to study the distribution of temperature and stress on the surface of KDP crystal before and after SPDT processing. The maximum transient temperature of the large size KDP crystal is measured to be 8 鈩，

本文编号：2059904