在空心聚苯乙烯微球表面电沉积Au-Cu双壳层（英文）

发布时间：2018-02-11 01:31

本文关键词： 双壳层复合微球电沉积　出处：《无机化学学报》2017年06期 　论文类型：期刊论文

【摘要】：PS/Au/Cu双壳层核壳复合微球是在自制的电沉积装置中首先在空心聚苯乙烯微球模板上电沉积金形成PS/Au微球,然后再电沉积Cu。首先,PS/Au微球保持了较好的球形度,其中沉积层Au粗糙度低,且厚度达到5.6μm。由于Au和铜有相同的面心立方晶体结构,所以Cu沿着Au的晶体结构在PS/Au表面沉积。微球断面Au-Cu结合非常紧致,Cu的厚度为8.62μm,Au的厚度为4.04μm。PS/Au/Cu微球和Au-Cu双壳层的形貌、厚度,成分和粗糙度是通过3D体式显微镜,SEM、EDS和XRD表征,其结果显示PS/Au/Cu微球及双壳层Au-Cu均匀细致,粗糙度低。
[Abstract]:The PS/Au/Cu double shell core-shell composite microspheres were first electrodeposited on hollow polystyrene microspheres template to form PS/Au microspheres in a self-made electrodeposition device, and then electrodeposited to Cu.Firstly, the PS / au microspheres kept a good sphericity. The roughness of au deposit is low, and the thickness of au is 5.6 渭 m. Because au and Cu have the same crystal structure, So Cu deposited on the surface of PS/Au along the crystal structure of au. The thickness of Cu is 8.62 渭 m au, the thickness of Au-Cu is 8.62 渭 m au, the thickness of Au-Cu double shell is 4.04 渭 m. The thickness, composition and roughness of the microsphere are characterized by 3D bulk microscope, SEMEDS and XRD. The results show that the PS/Au/Cu microspheres and double shell Au-Cu are uniform and fine, and the roughness is low.
【作者单位】：重庆文理学院机电工程学院;重庆文理学院新材料技术研究院;中国工程物理研究院激光聚变研究中心;
【基金】：supported financially by the field research project of Chongqing University of Arts and Sciences (Grant No.Z2014JD03)~~
【分类号】：O632.13;TQ153

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