微通道及导热柱结构对LTCC微波组件散热性能影响研究

发布时间：2018-02-12 02:28

  本文关键词： 微通道 导热柱 LTCC微波组件 散热性能　出处：《桂林电子科技大学》2017年硕士论文　论文类型：学位论文

【摘要】：低温共烧陶瓷(Low Temperature Co-fired Ceramic)具备低成本、高电阻率、低介电常数、可埋置无源器件以及与硅匹配的热膨胀系数等优越特性,广泛应用于高密度混合集成与微波射频的微波组件中。但是,LTCC微波组件的高度集成、功率密度的不断提高,使复杂工作环境下LTCC微波组件的热问题愈加明显,严重影响了LTCC微波组件的可靠性。在LTCC微波组件中采用微通道及导热柱结构,调控其结构参数能够改善LTCC微波组件的散热问题。本文结合相关科研项目工程应用所需,以某新型LTCC微波组件为研究对象,研究了微通道及导热柱结构参数对LTCC微波组件散热性能的影响,主要研究内容和结论如下:(1)针对微通道及导热柱结构散热机理进行了研究,确定了影响LTCC微波组件散热性能的主要结构参数和流体冷却方式。采用ANSYS有限元软件建立了LTCC微波组件有限元分析模型,进行了热-流耦合仿真分析。对流体四种不同进出口位置的布局方式Z型、I型、C型及L型进行了仿真优选分析。仿真结果表明,LTCC微波组件的整体温度分布均匀,最高温度出现在功率芯片上,微通道内的流体温度最低。对流体不同进出口布局方式的优选分析结果表明I型方式中LTCC微波组件功率芯片结温最低,为50.24℃;C型方式最高,为55.70℃;I型方式中流体进出口压强损失最小,为41.79KPa;Z型方式最大,为102.75KPa,即I型方式较优。(2)采用正交试验设计方法针对微通道及导热柱结构参数设计了6因素4水平的正交试验方案,根据试验方案进行了仿真分析,以LTCC微波组件功率芯片结温为响应结果,并对结果进行了数据有效性分析与极差分析。结果表明在一定范围内,结构参数对LTCC微波组件散热性能影响的程度依次是:导热柱直径导热柱个数出水口与进水口半径微通道截面宽度微通道截面高度导热柱高度。(3)采用基于JMP的逐步回归分析方法拟合得到了微通道及导热柱结构参数与LTCC微波组件散热性能数学关系模型,并对拟合的数学关系模型进行了评价分析与验证分析。分析结果数据表明,关系模型的拟合度高,显著性较强,初步描述了结构参数与LTCC微波组件散热性能的函数映射关系。(4)利用遗传算法对微通道及导热柱结构参数与LTCC散热性能数学关系模型进行了优化研究。得到的最优结构参数为:导热柱直径选用189μm;导热柱高度选用508μm;导热柱个数选用8个;微通道截面宽度选用0.716mm;微通道截面高度选用508μm;进水口与出水口半径选用1.047mm。优化后得到的LTCC微波组件功率芯片结温为32.41℃,降低了15.51%。表明优化后组件功率芯片结温明显降低,可以改善LTCC微波组件的散热性能。
[Abstract]:Low Temperature Co-fired Ceramic (low Temperature Co-fired Ceramic) has the advantages of low cost, high resistivity, low dielectric constant, buried passive devices and thermal expansion coefficient matching with silicon. It is widely used in microwave components with high density mixing integration and microwave RF. However, the high integration of LTCC microwave module and the continuous improvement of power density make the thermal problems of LTCC microwave modules more obvious in complex working environment. The reliability of LTCC microwave module is seriously affected. Adopting microchannel and heat conduction column structure in LTCC microwave module and adjusting its structural parameters can improve the heat dissipation problem of LTCC microwave module. Taking a new LTCC microwave module as the research object, the influence of the structure parameters of microchannel and heat conduction column on the heat dissipation performance of LTCC microwave module is studied. The main contents and conclusions are as follows: (1) the heat dissipation mechanism of microchannel and heat conduction column structure is studied. The main structural parameters and fluid cooling methods affecting the heat dissipation performance of LTCC microwave module are determined. The finite element analysis model of LTCC microwave module is established by using ANSYS finite element software. The thermo-fluid coupling simulation analysis was carried out. The layout of four different inlet and outlet locations of fluid, Z type I type C and L type, were selected and optimized. The simulation results show that the whole temperature distribution of LTCC microwave module is uniform. The highest temperature appears on the power chip and the fluid temperature in the microchannel is the lowest. The results of optimal selection and analysis of the different inlet and outlet configurations of the fluid show that the LTCC microwave module has the lowest junction temperature and the highest junction temperature is 50.24 鈩，

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