无氰碱性低锡铜-锡合金电镀工艺

发布时间：2018-02-16 05:23

  本文关键词： 无氰 碱性 低锡 铜-锡合金 镀液成分 工艺规范　出处：《电镀与环保》2017年03期 　论文类型：期刊论文

【摘要】：研究出一种无氰碱性低锡铜-锡合金电镀工艺。该工艺具有镀液成分简单、工艺稳定、节能降耗等优点。通过实验确定了最佳的镀液配方和工艺条件为:CuSO_4·5H_2O 45~55g/L,K_2CO_340~60g/L,Na_2SnO_3·3H_2O 8~12g/L,铜螯合剂190~230mL/L,锡螯合剂30~40mL/L,辅助调节剂6~10mL/L,pH值10~11,电流密度1.4~2.0A/dm~2,温度45~55℃。
[Abstract]:A non-cyanide alkaline low tin copper-tin alloy electroplating process has been developed, which has the advantages of simple composition and stable process. The optimum formula and technological conditions of the plating bath were determined by experiments as follows: 1 Cuso 4.5H 2O 45 / 55 g / L / L Mr. K2CO34060g / L T / L, 20 / 20 S 2SnO 3 路3H 2O 8 / 12g / L, 190230ml / L / L copper chelator, 3030ml / L tin chelator, 6n 10mL / L pH 1011g / L, current density 1.42.0Ar / m-2, temperature 4555 鈩，

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