射频模块成型缺陷与工艺参数的关系研究

发布时间：2018-03-24 07:07

本文选题：射频模块　切入点：影响因素　出处：《电子科技大学》2015年硕士论文

【摘要】：与传统的封装工艺技术相比,低温共烧陶瓷(LTCC)技术因其具有优良的高频特性、小线宽和低阻抗而倍受瞩目,但其工艺过程复杂,容易造成缺陷。造成缺陷的影响因素很多,研究主要影响因素与缺陷的关系是准确控制工艺参数的基础,也是制造出高质量产品的重要前提。本文针对某种射频模块,运用理论分析与仿真实验相结合的方法对LTCC技术成型过程中的缺陷进行分析,建立成型缺陷主要影响因素与缺陷评价指标之间的关系模型,为工艺参数的优化打下基础,提高射频模块的成型质量。为此本文从以下几个方面进行了研究:(1)成型缺陷的仿真分析。根据试制样件中存在的缺陷问题,检测出四种主要成型缺陷:微通道变形、基板翘曲、层间垂直互联错位、共晶焊接空洞,通过理论分析,研究缺陷的形成机制。根据成型缺陷的形成环境,利用ANSYS Workbench软件完成对四种成型缺陷的有限元仿真分析。(2)成型缺陷影响因素分析。根据缺陷对样件成型质量和功能特性的影响程度,提取缺陷的尺寸特征、纹理特征、形状特征等,确定缺陷的目标函数。利用正交试验方法,完成多组工艺条件下的缺陷仿真分析,从各影响因素中提取成型缺陷的主要影响因素。(3)成型缺陷与工艺参数关系模型的建立。在识别出成型缺陷主要影响因素的基础上,进行多水平主要影响因素的正交试验,而其它次要影响因素选取对成型质量有利的值,基于响应面法以及麦夸特法,建立起成型缺陷目标函数与主要影响因素之间的关系模型。(4)关系模型准确性的实验验证。为确保建模方法和仿真结果的正确性,在不同的工艺条件下试制样件,利用相应的检测方法对成型缺陷进行检测。通过实验检测结果与模型理论计算结果相比较,表明仿真分析结果可以接受,关系模型的准确度优于80%。
[Abstract]:Compared with the traditional packaging technology, low temperature co-fired ceramic LTCCs have attracted much attention because of their excellent high frequency characteristics, small linewidth and low impedance. However, the process is complex and easy to cause defects. The study of the relationship between the main influencing factors and the defects is the basis of accurate control of process parameters and an important prerequisite for the manufacture of high quality products. This paper analyzes the defects in the forming process of LTCC technology by combining theoretical analysis with simulation experiment, and establishes the relationship model between the main influencing factors of forming defects and the evaluation index of defects, which lays a foundation for the optimization of process parameters. In order to improve the forming quality of RF module, this paper studies the simulation analysis of the forming defects from the following aspects. According to the defects existing in the prototype, four main forming defects are detected: microchannel deformation, substrate warpage, Interlaminar vertical interconnection, eutectic welding voids, through theoretical analysis, the formation mechanism of defects. According to the forming environment of forming defects, ANSYS Workbench software is used to analyze the influencing factors of four kinds of forming defects. According to the influence degree of defects on forming quality and function, the size feature and texture feature of defects are extracted. Shape features, etc., to determine the objective function of defects. Using orthogonal test method, complete the simulation analysis of defects under multi-group process conditions. The relationship model between molding defects and process parameters was established by extracting the main influencing factors of forming defects from various influencing factors. Based on the identification of the main influencing factors of forming defects, orthogonal experiments were carried out on the main influencing factors at many levels. Other secondary factors are selected to benefit the molding quality, based on the response surface method and the McQuat method. In order to ensure the correctness of modeling method and simulation results, samples were manufactured under different technological conditions. By comparing the experimental results with the theoretical results, the simulation results are acceptable, and the accuracy of the relational model is better than that of the 80th model.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ174.6

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