粗化工艺对电解铜箔表面铜粉的影响

发布时间：2018-03-28 08:40

本文选题：电解铜箔　切入点：粗化　出处：《电镀与涂饰》2017年01期

【摘要】：研究了粗化电流密度、添加剂、硫酸含量等因素对电解铜箔表面铜粉和剥离强度的影响。结果表明:当粗化电流密度为30A/dm~2,硫酸含量为120 g/L,镍离子含量为0.5 g/L时,能有效地减少铜箔表面铜粉,保证产品质量的稳定。
[Abstract]:The effects of coarsening current density, additive and sulfuric acid content on copper powder and peeling strength on the surface of electrolytic copper foil were studied. The results show that when the coarsening current density is 30A / dm-2, the sulfuric acid content is 120 g / L, the nickel ion content is 0.5 g / L. It can effectively reduce copper powder on the surface of copper foil and ensure the stability of product quality.
【作者单位】：山东金宝电子股份有限公司;
【分类号】：TQ153

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