基于单颗磨粒的工程陶瓷磨削仿真与试验研究

发布时间：2018-05-06 13:51

本文选题：单颗磨粒磨削 + SiC陶瓷　；参考：《南京航空航天大学》2017年硕士论文

【摘要】：SiC陶瓷磨削加工对成形精度和表面完整性有着极高要求。针对SiC陶瓷的硬脆特性,采用大粒径金刚石的单层钎焊砂轮,具有较大的容屑空间和较高的磨粒把持力,在提高加工效率和减少工具磨损方面有着巨大优势。目前,关于SiC陶瓷的磨削机理研究,一般使用单颗磨粒磨削方法,但现有的研究方法不能够真实反映实际磨削过程。本文采用单颗磨粒钎焊砂轮,表征砂轮表面实际磨粒形态,同时通过控制磨削工艺参数,模拟磨粒实际运动轨迹。在此基础上,研究磨削参数和磨粒形状对SiC磨削加工的影响,对于提高磨削表面质量,以及减少磨削损伤有着重要意义。主要内容如下:(1)基于有限元分析软件,研究裂纹扩展形式,应力应变场及温度场的分布,并建立SiC陶瓷去除方式与应力形式之间的定性关系。结合磨削力仿真结果,初步选取相关工艺参数用于单颗磨粒磨削试验。(2)设计和制作单颗磨粒砂轮装置,开展单颗磨粒磨削试验。对比分析磨削速度和单颗磨粒最大切厚对SiC磨削加工的影响。测量磨削力并计算磨削比能,观测磨痕表面形貌和亚表面损伤。(3)基于“最小二乘法”,拟合计算金刚石磨粒刃圆半径。对比分析刃圆半径变化对SiC磨削加工的影响。研究刃圆半径与实际磨削前角之间的关系,及其对脆延转变的影响。(4)基于磨粒磨损不同形式,建立SiC陶瓷材料累积去除量与金刚石磨粒磨损量之间的定量关系。研究磨粒磨损对磨痕表面质量和磨削力的影响。
[Abstract]:SiC ceramic grinding has high requirements for forming accuracy and surface integrity. According to the hardness and brittleness of SiC ceramics, the single-layer brazed grinding wheel with large diameter diamond has great advantages in improving machining efficiency and reducing tool wear because of its large chip-holding space and high abrasive holding force. At present, the grinding mechanism of SiC ceramics is generally studied by single particle grinding method, but the existing research methods can not reflect the actual grinding process. In this paper, a single abrasive soldering wheel is used to characterize the actual abrasive particle shape on the surface of the grinding wheel, and the actual motion trajectory of the abrasive particle is simulated by controlling the grinding process parameters. On this basis, it is of great significance to study the effect of grinding parameters and particle shape on SiC grinding process, which is of great significance to improve the surface quality of grinding and reduce grinding damage. The main contents are as follows: (1) based on the finite element analysis software, the distribution of crack propagation, stress-strain field and temperature field is studied, and the qualitative relationship between the removal mode of SiC ceramics and the stress form is established. According to the simulation results of grinding force, the relevant parameters are selected to design and manufacture a single abrasive grinding wheel device, and to carry out a single abrasive grinding test. The effects of grinding speed and maximum cutting thickness of single grain on SiC grinding are analyzed. The grinding force was measured and the grinding specific energy was calculated. The surface morphology and subsurface damage were observed. Based on the "least square method", the diamond abrasive edge radius was fitted and calculated. The influence of the radius of the edge circle on the SiC grinding process is compared and analyzed. The relationship between the radius of the edge and the actual grinding angle and its effect on brittle ductility transition are studied. (4) based on the different wear patterns of abrasive particles, the quantitative relationship between the cumulative removal amount of SiC ceramic materials and the wear rate of diamond particles is established. The effects of abrasive wear on the surface quality and grinding force of wear mark were studied.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TQ174.6

【参考文献】