金刚石线切割走丝系统弯丝及张力控制研究

发布时间：2018-07-05 21:08

本文选题：硬脆材料 + 金刚石线切割　；参考：《南京航空航天大学》2017年硕士论文

【摘要】：固结磨料金刚石线切割技术,又称金刚石线锯切割技术,是近年来迅速发展的利用固结磨料金刚石线切割硬脆材料的加工技术,已经广泛应用于玻璃、硅晶体、石英晶体、硬质合金、陶瓷和稀土磁性材料等硬脆材料的锯切加工。随着半导体加工要求越来越高:一方面由于特殊形状半导体晶体的加工需求,使得金刚石线切割不断向大直径切割、轮廓切割和形状切割等方向发展;另一方面,又要求切割后的工件具有极高的加工质量和加工成品率。这些要求极大地提高了半导体等硬脆材料的加工难度,也对加工工具和加工设备提出了更高的要求。本课题针对以上问题,对现有的金刚石线切割机床的走丝系统和控制技术进行了改造。为解决金刚石线切割在型面切割过程中出现的弯丝影响切割件形状精度的问题,研制了基于金刚石线位置的检测及控制装置;为提高往复走丝金刚石线切割机床的切割稳定性和加工精度,针对其往复走丝加工过程中存在的金刚石线张力变化的问题进行了研究,研制了张力检测及调节机构。主要工作内容如下:(1)利用SolidWorks和Autocad软件对金刚石线切割弯丝检测机构和张力均衡控制机构的零部件进行设计,满足弯丝检测控制和张力检测控制的要求。编制零部件加工工艺,对零部件进行加工,完成对金刚石线切割机床走丝系统的改造。(2)研究了金刚石线切割过程中弯丝现象产生的原因,建立了金刚石线的挠曲量与切割抗力模型,提出了一种基于金刚石线位置检测的弯丝检测方法--光投影检测法,制定了弯丝检测控制方案,研制了基于金刚石线位置检测的双向检测控制系统,使其能进行金刚石线空间位置的判断并进行反馈控制。(3)分析了张力变化的影响因素,对张力变化对切割过程的影响进行了研究,建立了磨粒切割机理模型,设计了张力检测和控制机构,能够对金刚石线切割过程中的张力值进行实时检测,并且有效提高加工的稳定性和加工效率。(4)利用金刚石弯丝检测控制系统对多晶硅材料进行了切割效果的验证试验,切割厚度20mm,直径φ20mm的多晶硅圆度控制在0.05mm以内,大幅提高了切割形状精度及切割稳定性。(5)利用张力均衡控制系统对多晶硅材料进行了切割效果的验证试验,证明检测调节机构能有效控制金刚石线在往复走丝过程中张力不稳定的问题,正反向走丝张力波动幅度能控制在0.6N以内,并且切割效率、切割表面粗糙度及加工尺寸精度都有较大改善。
[Abstract]:Consolidation abrasive diamond wire cutting technology, also known as diamond wire saw cutting technology, is a rapid development in recent years using consolidated abrasive diamond wire cutting hard and brittle materials processing technology, has been widely used in glass, silicon crystals, quartz crystals, Sawing of hard and brittle materials such as cemented carbides, ceramics and rare earth magnetic materials. With the increasing requirements of semiconductor processing, on the one hand, due to the special shape of semiconductor crystal processing requirements, diamond wire cutting to the direction of large diameter cutting, contour cutting and shape cutting, on the other hand, It is also required that the cut workpiece have high machining quality and finished product rate. These requirements greatly improve the processing difficulty of hard and brittle materials such as semiconductors, and put forward higher requirements for processing tools and equipment. In order to solve the above problems, the wire-moving system and control technology of the existing diamond wire-cutting machine tools have been reformed. In order to solve the problem that the curved wire in the cutting process of diamond wire cutting affects the shape accuracy of cutting parts, a device for detecting and controlling the position of diamond wire is developed. In order to improve the cutting stability and machining accuracy of reciprocating wire walking diamond wire cutting machine, the problem of the change of diamond wire tension in the process of reciprocating wire walking is studied, and the tension detection and adjustment mechanism is developed. The main contents of the work are as follows: (1) the components of diamond wire cutting and tension equalization control mechanism are designed by SolidWorks and Autocad software to meet the requirements of wire bending control and tension detection control. The machining process of the parts and components is worked out, and the modification of the wire running system of the diamond wire cutting machine is completed. (2) the reason of the wire bending phenomenon in the diamond wire cutting process is studied. The model of flexure and cutting resistance of diamond wire is established, and a new method based on position detection of diamond wire, light projection detection method, is put forward, and the control scheme of wire bending detection is established. A bidirectional detection control system based on diamond line position detection is developed, which enables it to judge the spatial position of diamond wire and to control it with feedback. (3) the influencing factors of tension change are analyzed. The influence of the change of tension on the cutting process is studied. The mechanical model of abrasive cutting is established, and the tension detection and control mechanism is designed, which can detect the tension value in the process of diamond wire cutting in real time. It also improves the stability and efficiency of machining effectively. (4) the cutting effect of polysilicon is verified by diamond wire bending control system. The cutting thickness is 20mm and the diameter 蠁 20mm polysilicon roundness is controlled within 0.05mm. The cutting precision and stability are greatly improved. (5) the cutting effect of polysilicon is verified by using the tension equalization control system. It is proved that the detecting and regulating mechanism can effectively control the instability of the tension of diamond wire during the reciprocating process, and the fluctuation amplitude of the forward and backward striping tension can be controlled within 0.6 N, and the cutting efficiency is obtained. Cutting surface roughness and machining dimensional accuracy have been greatly improved.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TQ163

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