电铸铜箔材位置效应及微气胀成形性能研究
发布时间：2018-07-15 16:19
【摘要】：随着制造领域不断向微型化推进,微型零件的需求日益增加。铜箔成形性能优良,经微气压胀形可以获得结构微小、形状复杂的零部件,特别是微机电系统部件,其中电铸是一种常见的铜箔制备方法。微气压胀形作为微成形技术之一,成形精度高、少无回弹、可一次成形复杂零件,受到越来越多关注。提高坯料厚度均匀性与性能均一性有助于提高微气压胀形件的质量。因此开展电铸铜箔的厚度均匀性与性能均一性研究,并进行微气压胀形工艺探索,对于发展微成形技术具有重要的理论意义和实用价值。本文研究了占空比、电流密度、电源属性及电铸时间四个因素对电铸铜箔材均匀性的影响,并用正交实验法优化了工艺,确定了制备出均匀性良好铜箔材的工艺。采用该工艺制备的铜箔作为微气压胀形原材料,研究了电铸铜箔各位置内应力、组织和拉伸性能差异,后采用正交试验法研究胀形温度、压力和热处理工艺对极限胀形高度的影响以获得最优参数。本文主要结论如下:成功制备出具有均匀性良好的铜箔,均匀性优于现有文献报导。电铸最优工艺为采用双脉冲电源,正向占空比30%,负向占空比10%,电流密度为2A/dm2,电铸时间92min;CV值最低达到1.54%。厚度呈现位置51234的规律性。本论文采用双脉冲电流制备的铜箔各位置内应力差异显著,微观组织基本相同。电铸铜箔纯度高、强度高、塑性差。厚度相同时,其抗拉强度高于现有文献报导。抗拉强度存在位置效应,与不同位置晶粒的择优取向有很大关系。(111)和(200)织构能提升铜箔的抗拉强度;(220)织构会降低铜箔的抗拉强度。热处理工艺对极限胀形高度影响最大,不经过热处理的原始组织晶粒细小,胀形高度最高。胀形最优工艺为不经过热处理原料、胀形温度450℃C、压力2.4MPa。
[Abstract]:With the development of miniaturization in manufacturing field, the demand for micro-parts is increasing day by day. Copper foil has good formability, and parts with small structure and complicated shape can be obtained by micropneumatic bulging, especially micro electromechanical system. Electroforming is a common method of copper foil preparation. As one of the micro forming technologies, micro pressure bulging has attracted more and more attention because of its high precision and little springback, which can be used to form complex parts at one time. Improving the uniformity of blank thickness and property is helpful to improve the quality of micropneumatic bulging parts. Therefore, it is of great theoretical significance and practical value to study the uniformity of thickness and properties of electroforming copper foil and to explore the micro-pressure bulging process. In this paper, the effects of duty cycle, current density, power properties and electroforming time on the uniformity of electroforming copper foil are studied. The process of preparing copper foil with good uniformity is determined by orthogonal experiment. The stress, microstructure and tensile properties of electroforming copper foil were studied by using the copper foil prepared by this process as the raw material of micro-pressure bulging, and then the bulging temperature was studied by orthogonal test. The effect of pressure and heat treatment process on the limit bulging height to obtain the optimal parameters. The main conclusions are as follows: copper foil with good homogeneity is successfully prepared, and the uniformity is better than that reported in the literature. The optimum process of electroforming is to adopt double pulse power supply, the positive duty cycle is 30, the negative duty cycle is 10, the current density is 2A / dm ~ 2, and the electroforming time is 92 min CV is the lowest 1.54. The thickness shows the regularity of position 51234. In this paper, the internal stress of copper foil prepared by double pulse current has significant difference, and the microstructure of copper foil is basically the same. High purity, high strength and poor plasticity of electroforming copper foil. When the thickness is the same, the tensile strength is higher than that reported in the existing literature. The tensile strength has a position effect, which is related to the preferred orientation of grain in different position. (111) and (200) texture can increase the tensile strength of copper foil, (220) texture can reduce the tensile strength of copper foil. The effect of heat treatment process on the ultimate bulging height is the greatest, the original microstructure without heat treatment is fine, and the bulging height is the highest. The optimum bulging process is that the bulging temperature is 450 鈩，
本文编号：2124662
[Abstract]:With the development of miniaturization in manufacturing field, the demand for micro-parts is increasing day by day. Copper foil has good formability, and parts with small structure and complicated shape can be obtained by micropneumatic bulging, especially micro electromechanical system. Electroforming is a common method of copper foil preparation. As one of the micro forming technologies, micro pressure bulging has attracted more and more attention because of its high precision and little springback, which can be used to form complex parts at one time. Improving the uniformity of blank thickness and property is helpful to improve the quality of micropneumatic bulging parts. Therefore, it is of great theoretical significance and practical value to study the uniformity of thickness and properties of electroforming copper foil and to explore the micro-pressure bulging process. In this paper, the effects of duty cycle, current density, power properties and electroforming time on the uniformity of electroforming copper foil are studied. The process of preparing copper foil with good uniformity is determined by orthogonal experiment. The stress, microstructure and tensile properties of electroforming copper foil were studied by using the copper foil prepared by this process as the raw material of micro-pressure bulging, and then the bulging temperature was studied by orthogonal test. The effect of pressure and heat treatment process on the limit bulging height to obtain the optimal parameters. The main conclusions are as follows: copper foil with good homogeneity is successfully prepared, and the uniformity is better than that reported in the literature. The optimum process of electroforming is to adopt double pulse power supply, the positive duty cycle is 30, the negative duty cycle is 10, the current density is 2A / dm ~ 2, and the electroforming time is 92 min CV is the lowest 1.54. The thickness shows the regularity of position 51234. In this paper, the internal stress of copper foil prepared by double pulse current has significant difference, and the microstructure of copper foil is basically the same. High purity, high strength and poor plasticity of electroforming copper foil. When the thickness is the same, the tensile strength is higher than that reported in the existing literature. The tensile strength has a position effect, which is related to the preferred orientation of grain in different position. (111) and (200) texture can increase the tensile strength of copper foil, (220) texture can reduce the tensile strength of copper foil. The effect of heat treatment process on the ultimate bulging height is the greatest, the original microstructure without heat treatment is fine, and the bulging height is the highest. The optimum bulging process is that the bulging temperature is 450 鈩，
本文编号：2124662
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