添加剂对DMH体系电沉积金的影响
发布时间：2018-10-12 17:59
【摘要】：在以5,5'-二甲基已内酰脲(DMH)为配位剂的镀液体系中研究了添加剂C_4H_6O_2、C_7H_4NNa O_3S和C_(12)H_(25)SO_4Na对金电沉积工艺和电结晶过程的影响。阴极极化曲线测试中,金电沉积的最佳电势区间是-0.60~-1.2V,添加剂浓度在研究的范围内对阴极极化电势的影响较小。循环伏安曲线结果表明,反应界面上添加剂的吸附能够影响成核生长超电势,对金还原过程表现出抑制作用。电化学阻抗谱研究表明,镀液中加入添加剂后,电荷转移过程变得更加困难。SEM观察表明,添加剂改善了镀层质量,晶粒变得细致、均匀。XRD分析证实,两种镀液体系中获得的镀金层都沿着Au(111)和(220)晶面择优生长。
[Abstract]:The effects of additive C4H6O2S / C7H4NNaO3S and C12H25H25 SO_4Na on the electrodeposition process and electrocrystallization process of gold were studied in the plating bath system with 5-dimethylhexanoylurea (DMH) as the coordination agent, and the effects of the additives C4H6O2S and C7H4NNaO3S and C12H25 SO_4Na on the electrodeposition process and the electrocrystallization process of gold were studied. In the measurement of cathodic polarization curve, the optimum potential range of gold electrodeposition is -0.60 ~ 1.2V, and the concentration of additive has little effect on the cathodic polarization potential in the range of study. The results of cyclic voltammetry show that the adsorption of additives at the reaction interface can affect the superpotential of nucleation growth and inhibit the gold reduction process. Electrochemical impedance spectroscopy (EIS) showed that the charge transfer process became more difficult after the addition of additives in the bath. SEM observation showed that the additive improved the quality of the coating, and the grain size became fine and uniform. XRD analysis confirmed that, The gold-plated coatings obtained in both bath systems are preferred along the crystal planes of Au (111) and (220).
【作者单位】： 中国工程物理研究院电子工程研究所;哈尔滨工业大学化工学院;
【基金】：中国工程物理研究院科学技术发展基金(2014B0302043)
【分类号】：TQ153.18
本文编号：2267075
[Abstract]:The effects of additive C4H6O2S / C7H4NNaO3S and C12H25H25 SO_4Na on the electrodeposition process and electrocrystallization process of gold were studied in the plating bath system with 5-dimethylhexanoylurea (DMH) as the coordination agent, and the effects of the additives C4H6O2S and C7H4NNaO3S and C12H25 SO_4Na on the electrodeposition process and the electrocrystallization process of gold were studied. In the measurement of cathodic polarization curve, the optimum potential range of gold electrodeposition is -0.60 ~ 1.2V, and the concentration of additive has little effect on the cathodic polarization potential in the range of study. The results of cyclic voltammetry show that the adsorption of additives at the reaction interface can affect the superpotential of nucleation growth and inhibit the gold reduction process. Electrochemical impedance spectroscopy (EIS) showed that the charge transfer process became more difficult after the addition of additives in the bath. SEM observation showed that the additive improved the quality of the coating, and the grain size became fine and uniform. XRD analysis confirmed that, The gold-plated coatings obtained in both bath systems are preferred along the crystal planes of Au (111) and (220).
【作者单位】： 中国工程物理研究院电子工程研究所;哈尔滨工业大学化工学院;
【基金】：中国工程物理研究院科学技术发展基金(2014B0302043)
【分类号】：TQ153.18
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