与Ca-B-Si生带共烧的金导体浆料研究

发布时间：2018-10-17 18:35

【摘要】：基于低温共烧陶瓷(LTCC)技术的多芯片组件(MCM)具有组装密度高、重量轻、体积小等特点,是实现电子装备高性能和小型化的有效方法之一,在军用电子、航天航空、无线通信等领域具有广泛的应用需求。制约我国LTCC技术应用的关键是LTCC材料,包括基板材料、导体浆料、内埋元器件用材料等。其中与基板配套的导体浆料已经成为亟待解决的关键性材料之一。论文针对军用MCM应用需求,以与Ca-B-Si生带匹配烧结的Au导体浆料为研究对象,系统研究功能相、玻璃相、有机载体对导体浆料丝网印刷性与匹配共烧性能的影响规律,指导金导体浆料的工程研制。论文主要工作如下:(1)借助流变仪研究了有机载体(增稠剂分子量、增稠剂含量、触变剂种类、触变剂含量)、功能相体积分数(φ=13%、20%、46%)、功能相粒径(D50=0.9μm、1.8μm、3.1μm)及形貌对浆料流变性能的影响。结果表明:树脂分子量及触变剂含量的增加可以在浆料保持低的高剪切粘度下提高低剪切粘度;固相体积分数增大,浆料剪切粘度增加;当固相体积分数为13%时,可以忽略功能相粒径、形貌对浆料流变性能的影响,而用银导体浆料模拟研究金导体浆料的流变性能,获得了线分辨率为80μm左右的金导体浆料。(2)借助表面轮廓仪、热机械分析仪、扫描电镜研究了功能相粒径、粘结相组成及含量对浆料与生带共烧后翘曲变形及厚膜导体与基板界面微观结构的影响。结果表明:功能相粒径较小时,厚膜导体致密早,膜层与基板的界面处存在较多气孔;功能相粒径较大时,厚膜导体烧结不致密;银粉功能相粒径为1.8μm时,浆料与生带的共烧匹配性最佳。烧结工艺下流动性较好的粘结相,可以促进厚膜导体烧结致密,且可以通过粘结相的移动来降低内应力,调节共烧翘曲变形,但是厚膜导体致密早,在厚膜导体与基板的界面处留下大量气孔。烧结工艺下流动性较差的粘结相,其将在一定程度上阻碍固相致密化的进行,可以为基板致密时气体的排放提供较多的时间,但不能根据其位置变化调节共烧翘曲变形。(3)研究了功能相粒径、粘结相组成及含量对浆料与生带共烧后厚膜导体表面微观结构及粗糙度的影响。结果表明:功能相粒径对厚膜导体表面粘结相的分布无明显影响,但是随着功能相粒径的减小,厚膜导体表面粗糙度下降。采用流动性好的粘结相时,烧结后的厚膜导体表面致密且存在较多的粘结相,粘结相以叶片状凸起存在时会增大厚膜导体的表面粗糙度。粘结相含量增加,烧结后厚膜导体表面的粘结相增加。(4)根据银导体浆料的研究结果,优选出了金粉功能相粒径、有机载体配方、粘结相组成及含量,制备得到共烧匹配性能、丝焊性能良好的金导体浆料。
[Abstract]:Multichip (MCM) based on low temperature co-fired ceramic (LTCC) technology has the characteristics of high density, light weight and small volume. It is one of the effective methods to realize high performance and miniaturization of electronic equipment. Wireless communication and other fields have a wide range of applications. The key to the application of LTCC technology in China is the LTCC material, including substrate material, conductor paste material, embedded component material and so on. Among them, the conductor paste matched with the substrate has become one of the key materials to be solved. In order to meet the requirement of military MCM application, this paper studies the effect of functional phase, glass phase and organic carrier on the screen printing property and matching co-firing performance of the conductive paste, which is sintered with the Ca-B-Si belt, and the functional phase, glass phase and organic carrier are systematically studied. To guide the engineering development of gold conductor slurry. The main work of this paper is as follows: (1) the effects of organic carrier (thickener molecular weight, thickener content, thixotropic agent type, thixotropic agent content), functional phase volume fraction (蠁 = 1320%), functional phase particle size (D500.9 渭 m, 1.8 渭 m, 3.1 渭 m) and morphology on rheological properties of slurry were studied by means of rheometer. The results show that the increase of molecular weight of resin and thixotropic agent content can increase the low shear viscosity with low shear viscosity of the slurry, increase the volume fraction of solid phase, increase the shear viscosity of the slurry, and when the volume fraction of solid phase is 13, The influence of the particle size and morphology of functional phase on the rheological properties of the slurry can be ignored. The rheological properties of the gold conductor slurry are simulated with silver conductor slurry, and the gold conductor slurry with a linear resolution of about 80 渭 m is obtained. (2) with the aid of the surface profiler, The effects of particle size of functional phase, composition and content of bonding phase on the warpage and microstructure of the interface between thick film conductor and substrate after co-firing of slurry and raw strip were studied by scanning electron microscope (SEM). The results show that when the particle size of the functional phase is small, the thick film conductor is densified early, there are more pores at the interface between the film and the substrate, when the particle size of the functional phase is larger, the thick film conductor is not dense, and the particle size of the silver powder is 1.8 渭 m. The best matching property of co-firing between slurry and raw belt is obtained. The bonding phase with better fluidity under sintering process can promote the sintering densification of thick film conductor, and can reduce the internal stress and adjust the warpage deformation of co-firing by moving the bonding phase, but the thick film conductor is densified early. A large number of pores are left at the interface between the thick film conductor and the substrate. The bonding phase with poor fluidity under sintering process will hinder the solid phase densification to a certain extent and can provide more time for gas emission when the substrate is densified. But the warpage deformation of co-firing can not be adjusted according to the change of its position. (3) the effects of the particle size of functional phase, the composition and content of bonding phase on the microstructure and roughness of thick film conductor after co-firing of slurry and raw band are studied. The results show that the particle size of the functional phase has no effect on the distribution of the adhesive phase on the surface of the thick film conductor, but the roughness of the thick film conductor decreases with the decrease of the particle size of the functional phase. When good fluidity bonding phase is used, the surface of sintered thick film conductor is compact and there are many bonding phases, and the surface roughness of thick film conductor will be increased when the bonding phase exists as vane bulge. The content of binder phase increased and the bonding phase of thick film conductor surface increased after sintering. (4) according to the results of the research on silver conductor paste, the particle size of functional phase of gold powder, the formula of organic carrier, the composition and content of binder phase were selected, and the co-firing matching property was obtained. Gold conductor paste with good wire welding performance.
【学位授予单位】：国防科学技术大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ174.6

【参考文献】