无氰Cu-Sn合金仿金电镀新工艺及其镀层性能研究

发布时间：2018-11-21 20:54

【摘要】：仿金电镀作为一种装饰性镀层,备受研究人员的关注。Cu-Sn合金电镀作为代铬镀层已有多年的历史,电镀工艺成熟且镀层抗腐蚀性良好。若应用于仿金电镀,极具发展前景。因此,开发一种镀液稳定、镀层色泽金黄且耐腐蚀性能良好的新型无氰Cu-Sn合金仿金镀液,具有一定的社会价值和经济效益。若应用于实际工业生产,意义更为重大。本论文首先通过Hull槽实验探讨了在前人实验的基础上改变镀液组分实现无氰仿金电镀的可行性,研究结果表明:单纯地加入其它金属无法实现仿金电镀。其次,探讨了不同类型电镀添加剂对无氰Cu-Sn合金仿金电镀的影响,发现添加剂二甲氨基丙胺与环氧氯丙烷缩合物(H-3)和阳离子季铵盐(DDS)影响最为明显。正交实验分别确定了添加剂H-3和DDS的最佳电镀工艺,并评价了各添加剂对仿金镀层性能的影响。结果表明:添加剂H-3更适用于无氰Cu-Sn合金仿金电镀,其出光速度快,镀层光亮、平整,厚度分布均匀,耐腐蚀性能优良。接着,以含锡量(Sn%为13~15%)为衡量标准,通过方槽实验确定了含添加剂H-3的无氰Cu-Sn合金仿金电镀的最佳镀液组成及工艺条件,即Cu2P2O7·3H2O 14~22 g/L,Sn2P2O7 2.0~2.3 g/L,添加剂H-3 0.8~1.2 m L/L,K4P2O7·3H2O 240 g/L,电流密度0.7~1.0 A/dm2,电镀时间4~8 min。通过盐雾实验、电化学测试、SEM等测试手段对仿金镀层耐腐蚀性能进行表征。结果表明:无氰Cu-Sn合金仿金镀层具有良好的耐腐蚀性能,相对于基体铁是一种阴极保护镀层。最后,通过挂镀实验探讨了不同中间层(光亮镍层、光亮酸铜、无氰白铜锡)的仿金镀层色泽。结果表明:不同中间层的无氰Cu-Sn合金仿金电镀均能获得20 K仿金镀层,以光亮镍和无氰白铜锡中间层色泽最为金黄。考虑成本问题,本仿金电镀体系以无氰白铜锡中间层为最佳。
[Abstract]:As a decorative coating, Cu-Sn alloy plating has been used for many years, and the plating process is mature and corrosion resistance is good. If used in imitation gold plating, it has great development prospects. Therefore, it is of certain social value and economic benefit to develop a new cyanide-free Cu-Sn alloy gold-imitating bath with stable plating solution, golden color and good corrosion resistance. If applied to actual industrial production, the significance is even greater. In this paper, the feasibility of gold imitating electroplating without cyanide by changing the composition of bath on the basis of previous experiments was discussed by Hull cell experiment. The results showed that gold imitating electroplating could not be realized by adding other metals alone. Secondly, the effect of different kinds of electroplating additives on gold imitating plating of non-cyanide Cu-Sn alloy was discussed. It was found that the additive dimethylaminopropylamine had the most obvious effect on the condensation of epichlorohydrin (H-3) and cationic quaternary ammonium salt (DDS). The optimum electroplating process of additives H-3 and DDS was determined by orthogonal experiment, and the effects of additives on the properties of gold-imitating coatings were evaluated. The results show that the additive H-3 is more suitable for gold imitating electroplating of non-cyanide Cu-Sn alloy. It has the advantages of high luminous speed, bright and smooth coating, uniform thickness distribution and excellent corrosion resistance. Then, with the standard of tin content (Sn% = 13? 15%), the optimum bath composition and process conditions of gold imitating gold plating of Cu-Sn alloy containing additive H-3 were determined by square tank experiment, that is, Cu2P2O7 3H2O 144g / L, 22 g / L, Sn2P2O7 2.0 + 2.3 g / L, additive H-3 0.8 m / L 1.2 mL / L K4P 2O 7 3H2O 240 g / L, current density 0.7 + 1.0 A / dm2, electroplating time 48 min. The corrosion resistance of gold imitated coating was characterized by salt spray test, electrochemical test and SEM. The results show that the gold imitated coating of cyanide free Cu-Sn alloy has good corrosion resistance and is a cathodic protective coating compared with the substrate iron. Finally, the color and color of different intermediate layers (bright nickel layer, bright copper acid layer, cyanide free copper tin coating) were studied by hanging plating experiment. The results showed that 20 K gold imitated coating could be obtained by gold imitating plating of cyanide free Cu-Sn alloy in different interlayers, and bright nickel and cyanide free copper tin interlayer had the most golden color. Considering the cost, the gold-imitating electroplating system is the best intermediate layer of cyanide-free copper-tin.
【学位授予单位】：华南理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ153

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