铜箔表面化学气相沉积少层石墨烯

发布时间：2018-01-04 12:34

  本文关键词：铜箔表面化学气相沉积少层石墨烯　出处：《材料科学与工程学报》2016年01期 　论文类型：期刊论文

  更多相关文章： 石墨烯 铜箔 化学气相沉积法 盐酸 生长时间

【摘要】：利用化学气相沉积法(CVD法),在金属基底上生长大面积、少层数和高质量的石墨烯是近年来研究的热点。本研究采用CVD法,在常压高温条件下,以氩气为载体、氢气为还原气体、乙烯为碳源,在铜箔表面生长石墨烯。通过扫描电子显微图(SEM)、X射线衍射仪(XRD)和拉曼图谱(Raman)分析,发现铜箔表面质量和石墨烯的生长时间对石墨烯的层数和缺陷有较大影响。用20%的盐酸去除铜箔表面的保护膜和Cu_2O等杂质,铜箔在1000℃下退火60min可以使铜箔晶粒尺寸增大以及改善铜箔表面的形貌。研究发现生长时间为60s和90s时,制备的石墨烯薄膜对称性良好且层数较少。其中,生长时间为90s时,拉曼表征石墨烯的I_D/I_G值为0.7,表明其缺陷比较少。
[Abstract]:Using chemical vapor deposition (CVD) method to grow graphene on metal substrates with large area, few layers and high quality is a hot topic in recent years. In this study, CVD method was used at atmospheric pressure and high temperature. Graphene was grown on the surface of copper foil using argon as carrier, hydrogen as reducing gas and ethylene as carbon source. X-ray diffractometer (XRD) and Raman spectra (Raman). It was found that the surface quality of copper foil and the growth time of graphene had great influence on the number of layers and defects of graphene. 20% hydrochloric acid was used to remove impurities such as protective film and Cu_2O on the surface of copper foil. After annealing at 1000 鈩，

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