Ag40Cu23Zn31In4Ni2银基钎料新加工工艺及其组织性能研究

发布时间：2018-01-29 11:04

  本文关键词： 银基钎料 电磁压制 烧结工艺 致密度 润湿性　出处：《热加工工艺》2016年23期 　论文类型：期刊论文

【摘要】：采用电磁压制和粉末冶金技术相结合的方法制备了Ag40Cu23Zn31In4Ni2银基钎料箔片,分析了电磁压制中电压参数对压坯致密度的影响以及烧结工艺参数对烧结坯密度和显微组织的影响,并对该钎料的铺展润湿性进行了讨论。结果表明:随着放电电压的增加,Ag40Cu23Zn31In4Ni2银基钎料的压坯致密度呈上升逐渐变缓,最后下降的趋势,在1300 V获得最高致密度81.85%;当烧结时间一定时,在一定的烧结温度范围内,随着温度升高,烧结坯致密度提高;而烧结温度一定时,随着烧结时间增长,烧结坯致密度降低。润湿铺展性试验中发现:1300 V电压下压制的压坯在650℃温度下烧结0.5 h后获得的钎料箔片,其铺展面积可达到298.5 mm~2,具有良好的润湿性,能满足Ag40Cu23Zn31In4Ni2银基钎料的使用要求。该结果可为电磁压制制备无镉中温银基钎料新技术的工程应用提供理论和数据支持。
[Abstract]:Ag40Cu23Zn31In4Ni2 silver based brazing foil was prepared by electromagnetic pressing and powder metallurgy. The influence of voltage parameters on compaction density and the effect of sintering process parameters on density and microstructure of sintered billet were analyzed. The wettability of the filler metal was discussed. The results showed that the density of Ag 40Cu23Zn31In4Ni2 filler metal increased gradually with the increase of discharge voltage. At 1300 V, the maximum density was 81.85; When the sintering time is constant, the density of sintered billet increases with the increase of sintering temperature in a certain range of sintering temperature. When the sintering temperature is fixed, the sintering time increases. The density of the sintered billet was decreased. The brazing foil was found in the wetting spreading test after sintering at 650 鈩，

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