SPCC钢碱性无氰直接预镀铜工艺研究

发布时间：2018-01-29 16:21

  本文关键词： SPCC钢 镀银 HEDP 碱性无氰 预镀铜 组织 性能　出处：《表面技术》2017年08期 　论文类型：期刊论文

【摘要】：目的提高LED支架的性价比,减少SPCC钢表面镀银预镀铜工艺的镀液污染,简化现有的预镀镍-镀铜施镀工艺,提高预镀层质量。方法采用HEDP碱性无氰直接预镀铜方法来简化工艺,用单因素实验法,系统研究了电流密度、镀液pH、电镀温度、HEDP/Cu~(2+)摩尔比、电镀时间等参数,对镀层镀速、孔隙率及镀层表面质量的影响,并表征镀层的微观组织及镀层结合力。结果在阴极电流密度为1.41 A/dm~2,pH值为9.5,温度为50℃,HEDP/Cu~(2+)摩尔比为3.75:1(Cu~(2+)为10 g/L),时间为11 min的条件下,可获得镀速约为1.7 mg/(cm~2·min)的预镀铜层,且镀层与基体的结合力良好,无孔隙,呈良好的光亮/半光亮状的细晶镀层。结论与钢铁表面氰化镀铜及镀银前预镀铜工艺相比,推荐的HEDP直接预镀铜工艺的镀层质量好,可满足直接镀铜和镀银前预镀铜工艺要求,可有效减少镀液污染和简化施镀工艺,对SPCC钢的镀铜工艺改善具有较好的推广价值。
[Abstract]:Objective to improve the ratio of performance to price of LED scaffolds, reduce the contamination of the solution of silver pre-copper plating on SPCC steel surface, and simplify the existing pre-nickel plating and copper plating process. In order to improve the quality of pre-plating, HEDP alkaline cyanide-free direct preplating was used to simplify the process. The current density, bath pH and electroplating temperature were systematically studied by single factor experiment. The effects of HEDP/Cu~(2 molar ratio, electroplating time and other parameters on the plating speed, porosity and surface quality of the coating. The microstructure and adhesion of the coating were characterized. Results the cathodic current density was 1.41 A / D ~ (2 +) and pH value was 9.5, and the temperature was 50 鈩，

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