冷热冲击对无铅钎料可靠性的影响

发布时间：2018-02-04 21:55

本文关键词： 无铅钎料冷热疲劳断裂模式　出处：《焊接学报》2017年03期 　论文类型：期刊论文

【摘要】：文中对比了一种新型低银钎料Sn-Ag-Cu-Bi-Ni(SACBN07)与市场上的SAC305,SAC0307两种无铅钎料的抗冷热冲击性能.利用纳米压痕试验等微观测试方法研究时效后界面组织及力学性能的变化.结果表明,SACBN07的抗冷热冲击性能最好,焊点失效后三种材料中裂纹的扩展路径不同,SAC305失效裂纹位于体钎料中,SACBN07钎料断裂位置逐渐由钎料基体转移到金属间化合物(IMC)层中,而SAC0307断裂位于界面IMC中;钎料中Bi,Ni元素的加入有效地抑制了IMC的生长,相同冷热冲击时间,SACBN07钎料中界面IMC厚度最薄;SACBN07体钎料的硬度受冷热冲击影响最小,时效后仅降低了8.6%,而SAC305与SAC0307分别降低了12.5%和28.3%.
[Abstract]:In this paper, a new type of low silver solder Sn-Ag-Cu-Bi-NiGSACBN07) is compared with the SAC305 in the market. The cold and thermal shock resistance of two lead-free SAC0307 solders was studied. The microstructure and mechanical properties of the interface after aging were studied by nano-indentation test. The resistance of SACBN07 to cold and thermal shock is the best. The crack propagation paths of the three kinds of materials are different after the failure of solder joint. The failure crack of SAC305 is located in the solder. The fracture position of SACBN07 solder is transferred from the filler metal matrix to the intermetallic compound (IMC) layer, while the SAC0307 fracture is located in the interface IMC. The growth of IMC was effectively inhibited by the addition of Bi-Ni in the filler metal, and the thickness of interface IMC was the thinnest in the same cold and hot impact time. The hardness of SACBN07 solder is the least affected by cold and heat shock. After aging, the hardness of SACBN07 solder decreases only 8.6%, while SAC305 and SAC0307 decrease 12.5% and 28.3 respectively.
【作者单位】：哈尔滨理工大学材料科学与工程学院;上海航天通讯设备研究所;
【基金】：国家自然科学基金资助项目(51174069)
【分类号】：TG425
【正文快照】： 0序言近几年,Sn-Ag-Cu(SAC)系钎料作为Sn-Pb共晶钎料的替代品得到了市场的认可,其中以日本电子工业协会(JEIDA或JEITA)推荐的SAC305最受关注.然而随着银价格的不断攀升,市场上广泛应用的SAC305钎料高成本的问题也愈发突出,相关研究[1]也表明:银含量过高会导致体钎料中生成大片

【相似文献】