化学镀铜体系的电化学性能

发布时间：2018-03-03 07:44

本文选题：化学镀铜　切入点：电化学性能　出处：《过程工程学报》2016年01期 　论文类型：期刊论文

【摘要】：对乙二胺四乙酸二钠(EDTA?2Na)与酒石酸钾钠(TART)双络合化学镀铜液进行了电化学研究,考察了络合剂与2,2?-联吡啶对阴、阳极极化反应的影响.结果表明,化学镀铜阳极极化受电化学与扩散混合控制,阴极极化受扩散控制;EDTA?2Na与TART通过竞争络合与竞争放电影响极化反应,而2,2?-联吡啶以弥散吸附方式改变极化阻抗影响铜的沉积;在优化镀液(EDTA?2Na 13.35 g/L,TART 13.35 g/L,2,2?-联吡啶15 mg/L)中化学镀铜,镀速达14.83 mg/min,所得镀层均匀致密.
[Abstract]:4-ethylenediamine tetraacetate disodium EDTAA? 2Na2) and potassium tartrate sodium tartrate (TARTT) double complexing electroless copper plating solution were studied by electrochemical method. The effect of bipyridine on the anodic and anodic polarization of electroless copper plating is studied. The results show that the anodic polarization of electroless copper plating is controlled by the mixture of electrochemistry and diffusion, and the cathodic polarization is controlled by diffusion. 2Na and TART affect the polarization reaction by competitive complexation and competitive discharge, while 2N? Bipyridine influences copper deposition by changing polarization impedance in the form of dispersion adsorption. 2Na 13.35 g/L,TART 13.35 g/L,2,2? Electroless copper plating in bipyridine 15 mg / L, the plating rate is 14.83 mg / min, and the coating is uniform and dense.
【作者单位】：昆明理工大学冶金与能源工程学院;
【分类号】：TG174.4

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