工艺参数对铜锰合金镀层组织和成分的影响

发布时间：2018-03-11 05:34

本文选题：电镀　切入点：Cu-Mn合金镀层　出处：《表面技术》2017年04期 　论文类型：期刊论文

【摘要】：目的在基体表面制备出均匀平整、致密且与基体结合良好的合金镀层,合金镀层中Mn的原子数分数达20%以上。方法用电沉积方法以氯酸盐体系,用EDTANa2作为络合剂,在SUS430不锈钢表面制备了Cu-Mn合金镀层,利用SEM及EDS研究了镀层的微观形貌及成分变化,分析了电流密度、pH值、沉积时间、电解液中n(Cu):n(Mn)比等参数对镀层微观结构和成分的影响。结果电流密度为200~700 m A/cm~2、pH值为3~7、时间为10~30 min和n(Cu):n(Mn)比为1:20~1:10时,镀层中的Mn含量随电流密度、pH值及时间的增大而增大,随着n(Cu):n(Mn)比值的增大而减小。结论电镀Cu-Mn合金的优化工艺参数是:电流密度为500 m A/cm2,pH值为5,时间为20 min,n(Cu):n(Mn)比为1:10。此时能够得到均匀、致密、与基体结合良好的合金镀层,且合金镀层中Mn的原子数分数能达到20%以上。质量良好的Cu-Mn合金镀层在固体氧化物燃料电池中具有潜在的应用价值。
[Abstract]:Aim to prepare a uniform, compact and well-bonded alloy coating on the substrate. The atomic fraction of mn in the alloy coating is over 20%. Methods the chlorate system and EDTANa2 were used as complexing agent in electrodeposition method. Cu-Mn alloy coating was prepared on the surface of SUS430 stainless steel. The microstructure and composition of the coating were studied by SEM and EDS. The current density, pH value and deposition time were analyzed. The effect of different parameters on the microstructure and composition of the coating was studied. The results showed that when the current density was 200 ~ 700m / cm ~ (-2), the pH value was 3 ~ 7, the time was 10 ~ 30 min and the n ~ (2 +) / Cu _ (1): n ~ (2 +) ratio was 1 20: 1: 10, the mn content in the coating increased with the increase of pH value and time of the current density. Conclusion the optimum technological parameters of electroplating Cu-Mn alloy are as follows: the current density is 500m / cm ~ (-2) pH value is 5, and the time is 20 min ~ (-1): n ~ (2 +) mn ratio is 1: 10. At this time, a uniform, dense alloy coating with good bonding with the substrate can be obtained. The atomic fraction of mn in the alloy coating can reach more than 20%. The Cu-Mn alloy coating with good quality has potential application value in solid oxide fuel cell.
【作者单位】：西安科技大学材料科学与工程学院;
【基金】：国家自然科学基金(51201131) 陕西省青年科技新星项目(2013KJXX-42) 西安科技大学培育基金(6310214005);西安科技大学博士启动金(6310115012)~~
【分类号】：TG174.4

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