当前位置:主页 > 科技论文 > 铸造论文 >

铜合金表面巯基官能有机硅溶胶-凝胶涂层中TEOS含量对其防腐性能的影响

发布时间:2018-03-17 16:28

  本文选题:铜合金 切入点:溶胶-凝胶涂层 出处:《中国腐蚀与防护学报》2016年01期  论文类型:期刊论文


【摘要】:以巯基丙基三甲氧基硅烷(MPTMS)为有机前驱体,以正硅酸四乙酯(TEOS)为无机前驱体,盐酸为催化剂,经水解-缩合反应在Cu合金H62表面制备了高固含量的有机-无机杂化溶胶-凝胶涂层。利用红外光谱仪、动态光散射粒度分析仪对涂层的化学成分和溶胶粒子的平均直径进行表征,利用SEM观察涂层的表面和截面形貌,利用拉脱法附着力测试仪和电化学工作站对涂层的附着力和耐蚀性进行表征。结果表明:TEOS的加入有利于提高涂层的热稳定性。随着TEOS含量的增加,溶胶粒子的尺寸呈上升趋势,过量的TEOS会使涂层表面和内部产生孔洞和裂纹等缺陷。当TEOS和MPTMS的摩尔比为0.6时,涂层的交联密度较大且涂层缺陷较少,涂层的耐蚀性最佳。
[Abstract]:Using mercapto propyl trimethoxy silane as organic precursor, tetraethyl orthosilicate as inorganic precursor, hydrochloric acid as catalyst, Organic inorganic hybrid sol-gel coatings with high solid content were prepared on the surface of Cu alloy H62 by hydrolysis-condensation reaction. The chemical composition of the coating and the average diameter of the sol particles were characterized by dynamic light scattering particle size analyzer. The surface and cross-section morphology of the coating were observed by SEM. The adhesion and corrosion resistance of the coatings were characterized by a tensile and desorption adhesion tester and an electrochemical workstation. The results showed that the addition of 1: TEOS was beneficial to improve the thermal stability of the coatings. With the increase of TEOS content, the size of the sol particles increased. When the molar ratio of TEOS and MPTMS is 0.6, the cross-linking density of the coating is higher and the coating defect is less, the corrosion resistance of the coating is the best.
【作者单位】: 中北大学材料科学与工程学院;中国科学院宁波材料技术与工程研究所中国科学院海洋新材料与应用技术重点实验室浙江省海洋材料与防护技术重点实验室;
【基金】:国家重点基础研究发展计划项目(2014CB643305) 国家自然科学基金项目(51202263和51335010) 浙江省“海洋防护材料与工程技术”科技创新团队项目(2011R50006) 宁波市自然科学基金项目(2014A610132)资助
【分类号】:TG174.4

【相似文献】

相关期刊论文 前2条

1 ;Kinetic Study of SiO_2/S Coating Deposition by APCVD[J];Journal of Materials Science & Technology;2007年04期

2 ;[J];;年期



本文编号:1625559

资料下载
论文发表

本文链接:https://www.wllwen.com/kejilunwen/jiagonggongyi/1625559.html


Copyright(c)文论论文网All Rights Reserved | 网站地图 |

版权申明:资料由用户dbc8d***提供,本站仅收录摘要或目录,作者需要删除请E-mail邮箱bigeng88@qq.com