纳米尺度单晶铜材料表面切削特性分子动力学模拟

发布时间：2018-03-29 23:26

本文选题：单晶铜　切入点：切削性能　出处：《中国机械工程》2016年06期

【摘要】：采用分子动力学模拟方法研究单晶铜材料表面纳米切削特性。通过对单晶铜纳米切削过程进行分子动力学建模、计算与分析,研究了不同切削速度及切削厚度对单晶铜材料表面纳米切削过程中微观接触区域原子状态和切削力变化的影响规律。研究结果发现:在单晶铜表面纳米切削过程中,切削速度越高,切屑堆积体积越大,切屑里原子的排列越紧密,位错缺陷分布区域越大;在同种切削速度下,切削厚度越大,在刀具前方堆积的切屑体积越大,位错缺陷越多。不同切削速度及切削厚度下,切削力曲线均在切削初期呈上升趋势,达到稳定切削状态后围绕稳定值进行波动,但在切削初期,切削速度及切削厚度越大,切削力上升幅度越大;达到稳定切削状态后,切削速度、切削厚度越大,切削力越大。
[Abstract]:The characteristics of nano-cutting on the surface of single crystal copper were studied by molecular dynamics simulation method, and the molecular dynamics modeling, calculation and analysis of the process of nanoscale cutting of single crystal copper were carried out. The effects of different cutting speeds and cutting thickness on the atomic states and cutting forces in the microcosmic contact region during nanometer-cutting of single crystal copper surface were studied. The results show that: in the process of nano-cutting on the surface of single crystal copper, At the same cutting speed, the larger the cutting thickness, the larger the chip volume, the larger the chip size, the closer the atomic arrangement in the chip, and the larger the distribution of dislocation defects, and the larger the chip volume in front of the cutting tool, the larger the cutting thickness at the same cutting speed. The more dislocation defects are, the higher the cutting force curve is at the beginning of cutting, but the more the cutting speed and thickness are at the beginning of cutting, the higher the cutting force curve is. The larger the increasing range of cutting force is, the greater the cutting speed and thickness are, the greater the cutting force is.
【作者单位】：昆明理工大学;
【基金】：国家自然科学基金资助项目(51365021)
【分类号】：TG501

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