退火温度对T2纯铜微结构演变及力学性能的影响

发布时间：2018-03-31 13:34

  本文选题：损伤演变　切入点：形状因子　出处：《材料热处理学报》2017年12期

【摘要】：利用扫描电镜、光学显微镜、MTS试验机、显微硬度计等分析了T2纯铜薄板的显微组织和力学性能,探讨了退火温度对T2纯铜微结构演变行为的影响。结果表明,材料的屈服应力、拉伸应力及显微硬度随着退火温度的升高而减小。不同晶粒尺寸的材料形状因子随着应变增大具有相似的变化趋势,晶粒尺寸越大形状因子变化越大。不同晶粒尺寸的材料相对形状因子的变化非常相似,相对形状因子的相对增长趋势大致相同。通过指数函数对材料的归一化形状因子曲线进行了拟合,建立了拟合方程。分析了T2纯铜在不同退火温度下归一化形状因子随塑性变形的演变规律。
[Abstract]:The microstructure and mechanical properties of T2 pure copper sheet were analyzed by means of scanning electron microscope, optical microscope, MTS tester and microhardness tester. The effect of annealing temperature on the evolution behavior of T2 pure copper microstructure was discussed. The tensile stress and microhardness decrease with the increase of annealing temperature. The larger the grain size, the greater the change of shape factor. The change of relative shape factor of materials with different grain sizes is very similar. The relative growth trend of the relative shape factor is approximately the same. The normalized shape factor curve of the material is fitted by exponential function. A fitting equation was established and the evolution of normalized shape factor of T2 pure copper with plastic deformation at different annealing temperatures was analyzed.
【作者单位】： 内蒙古工业大学力学系;内蒙古工业大学材料科学与工程学院;
【基金】：国家自然科学基金(11662011)
【分类号】：TG166.2
，

本文编号：1690957