药芯焊锡丝飞溅性能的改进和预测

发布时间：2018-03-31 15:05

本文选题：助焊剂　切入点：蒸汽压　出处：《高校化学工程学报》2017年01期

【摘要】：设计一种测量助焊剂高温下分解压力的装置,模拟药芯焊锡丝中助焊剂在焊接温度下封闭环境中所产生的变化,探究了加入不同松香和有机酸对助焊剂高温下分解产生压力的影响,采用扩展率实验,对以不同松香作为载体助焊剂的活性和焊后残留进行研究。结果表明含有改性松香的助焊剂分解产生压力比普通松香小,其中氢化松香甘油酯的加入对助焊剂分解压力减小最有利,最终压力为16 k Pa。实验中比较的三种有机酸活性剂,含有高沸点辛二酸的助焊剂分解压力最低为17 k Pa,扩展率实验显示改性松香残留较少,扩展率与无色氢化松香相近。文中设计了三种分解蒸汽压值不同的助焊剂,并灌芯拉丝制成锡丝后进行飞溅率测试,结果表明分解蒸汽压值较低,所制锡丝的飞溅率也较低,消泡剂的加入对减少助焊剂的飞溅率有显著作用,三款助焊剂的分解蒸汽压值最高分别为34、27和26 k Pa,锡丝的飞溅率分别为0.67%,0.32%,0.30%。
[Abstract]:A device for measuring the decomposition pressure of flux at high temperature is designed to simulate the change of flux in flux-cored solder wire in a closed environment at welding temperature. The effects of different rosin and organic acids on the pressure of flux decomposition at high temperature were investigated. The activity of different rosin carrier flux and the residual after welding were studied. The results showed that the pressure of flux decomposition with modified rosin was lower than that of common rosin. The addition of hydrogenated rosin glycerol ester is the most favorable to decrease the decomposition pressure of flux, and the final pressure is 16 kPa.Three organic acid active agents compared in the experiment, The decomposition pressure of fluxes containing high boiling point octanedioic acid is the lowest 17 kPa.The expansion rate experiment shows that the modified rosin residue is less and the expansion rate is close to that of colorless hydrogenated rosin. In this paper, three kinds of soldering fluxes with different decomposition vapor pressure values are designed. The spatter rate of the tin wire was measured after pouring into the wire. The results showed that the decomposition steam pressure value was lower and the spatter rate of the tin wire was lower, and the addition of defoamer had a significant effect on reducing the splashing rate of the flux. The highest decomposition vapor pressure values of the three fluxes were 34.27 and 26kPa.The splashing rates of the tin wires were 0.670.320.32 and 0.30kPa, respectively.
【作者单位】：华南理工大学化学与化工学院;广州汉源新材料有限公司;
【分类号】：TG422.3

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