Co-Cu-Pb三元合金的快速凝固组织及电学性能研究

发布时间：2018-03-31 16:14

本文选题：金属材料　切入点：Co-Cu-Pb难混溶合金　出处：《机械工程学报》2017年18期

【摘要】：采用单辊快速凝固技术研究Co-Cu-Pb三元难混溶合金薄带的快速凝固组织特征及电学性能,并通过将金属熔体热传导方程与Navier-Stokes方程相耦合,理论计算合金薄带的冷却速率。结果表明:在急冷快速凝固条件下,Co-Cu-Pb三元难混溶合金薄带的凝固组织由优先生长的Co(Cu)相枝晶骨架和枝晶间的富Pb相组成。随着冷却速率的增大,Co(Cu)相枝晶尺寸明显减小,凝固组织均匀性得到改善;而随着Pb含量的增大,少量的Pb相析出存在于Co(Cu)相枝晶干上。冷却速率的增大,合金薄带组织均匀性引起电子散射源减少,导致自由电子的散射作用减弱,使得合金薄带的电阻率减少。而合金中Pb含量的增大,减少了导电的有效电荷数,使得合金薄带的电阻率增大。快速凝固技术有效地改善了Co-Cu-Pb难混溶合金薄带的凝固组织均匀性和电学性能。
[Abstract]:The rapid solidification microstructure and electrical properties of Co-Cu-Pb ternary inmiscible alloy strip were studied by means of single roll rapid solidification technique. The cooling rate of alloy strip was calculated theoretically by coupling the heat conduction equation of metal melt with Navier-Stokes equation.The results show that the solidification structure of Co-Cu-Pb ternary inmiscible alloy ribbons under rapid solidification condition is composed of the preferential growth of the Co _ (Cu) phase dendritic framework and the Pb rich phase between the dendrites.With the increase of cooling rate, the size of the dendrite decreases obviously, and the homogeneity of solidification microstructure is improved, while with the increase of Pb content, a small amount of Pb precipitates on the dendritic stem of CocoCuCu) phase.With the increase of cooling rate, the uniformity of the microstructure of the alloy strip leads to the decrease of the electron scattering source, which leads to the weakening of the scattering effect of the free electrons and the decrease of the resistivity of the alloy strip.The increase of Pb content in the alloy decreases the effective charge number and increases the resistivity of the alloy strip.Rapid solidification technology can effectively improve the solidification structure uniformity and electrical properties of Co-Cu-Pb inmiscible alloy ribbons.
【作者单位】：郑州航空工业管理学院河南省航空材料与应用技术重点实验室;郑州大学材料科学与工程学院;
【基金】：河南省科技攻关(162102210241) 河南省高等学校重点科研(17A430007)资助项目
【分类号】：TG146.16

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