机械合金化制备Ag-Cu-Sn钎料的组织和热稳定性

发布时间：2018-04-05 09:51

本文选题：Ag-Cu-Sn钎料　切入点：过饱和固溶体　出处：《材料科学与工程学报》2017年04期

【摘要】：研究了机械合金化制备Ag-Cu-Sn三元体系形成过饱和固溶体的可能性,并对所得到的非平衡球磨产物的组织结构、热稳定性及其铺展重熔后的金相组织进行了表征。结果表明,通过控制球磨工艺和第三组元含量,可得到以过饱和固溶体为主要组成相的钎料合金粉,减少或细化脆性金属间化合物相。真空退火时,富银固溶体相较稳定,富铜固溶体相易于分解生成Cu_3Sn,银锡化合物可分解形成Ag基固溶体和富锡相,铜锡化合物的分解产物则为多种中间相,随退火温度的升高,转变顺序逐渐向铜锡原子比例增大的方向进行。以过饱和固溶体为主要组成相的钎料合金粉在重熔后虽然仍存在金属间化合物相,但金相组织明显细化。
[Abstract]:The possibility of forming supersaturated solid solution in Ag-Cu-Sn ternary system by mechanical alloying was studied. The microstructure, thermal stability and metallographic structure of the obtained non-equilibrium ball milling products were characterized.The results show that by controlling the ball milling process and the content of the third component, the solder alloy powder with supersaturated solid solution as the main phase can be obtained, and the brittle intermetallic phase can be reduced or refined.During vacuum annealing, the Ag-rich solid solution phase is more stable, the copper-rich solid solution phase is easy to decompose to form CuS3 Sn.The Ag base solid solution and rich tin phase can be decomposed into Ag base solid solution and rich tin phase, and the decomposition products of Cu Sn compound are various mesophase, and with the increase of annealing temperature,The transition sequence is gradually moving towards the increase of the ratio of copper and tin atoms.Although intermetallic phase still exists in the filler alloy powder with supersaturated solid solution as the main phase after remelting, the metallographic structure is obviously refined.
【作者单位】：哈尔滨工业大学先进焊接与连接国家重点实验室;中国计量大学材料科学与工程学院;杭州华光焊接新材料股份有限公司;
【基金】：浙江省自然科学基金资助项目(LY16F050005)
【分类号】：TG425

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