微量Ni对Sn2.5Ag0.7Cu钎料组织和性能的影响

发布时间：2018-04-18 08:03

  本文选题：钎焊 + 界面　； 参考：《铸造技术》2017年11期

【摘要】：研究微量Ni元素对Sn2.5Ag0.7Cu钎料显微组织和力学性能的影响。结果表明,Sn2.5Ag0.7Cu合金主要由β-Sn相、Ag3Sn相和Cu6Sn5相组成;添加微量的Ni元素后,可以有效地细化合金的内部组织,且共晶组织内部产生以Cu6Sn5相为基的(Cu,Ni)6Sn5相,或Ag3Sn相为基的(Ag,Ni)3Sn相。焊点界面主要为Cu基体、IMC层和钎料3个区域;随着钎焊时间的延长或钎焊温度的增加,IMC层在Cu基体侧较为光滑平坦,而钎料侧呈现扇贝状分布;钎焊接头的剪切强度都是呈先增大后减小趋势,在钎焊时间240 s和钎焊温度300℃达到最大值48 MPa。
[Abstract]:The effect of trace Ni on microstructure and mechanical properties of Sn2.5Ag0.7Cu solder was studied.The results show that Sn2.5Ag0.7Cu alloy is mainly composed of 尾 -Sn phase, Ag3Sn phase and Cu6Sn5 phase, and the internal microstructure of the alloy can be effectively refined by adding trace Ni element, and the Cu6Sn5 phase is formed in the eutectic structure, or the Agni Ni3Sn phase based on Ag3Sn phase is formed.The interface of the solder joint is mainly composed of three regions: cu substrate IMC layer and brazing filler metal. With the prolongation of brazing time or the increase of brazing temperature, the IMC layer is smooth and flat on the Cu substrate side, while the brazing alloy side presents a scallop distribution.The shear strength of brazed joints increased first and then decreased, reaching a maximum of 48 MPA at the brazing time of 240 s and the brazing temperature at 300 鈩，

本文编号：1767494