高致密细晶W-25Cu触头材料的电接触性能

发布时间：2018-04-21 15:22

本文选题：高致密 + 细晶　；参考：《中国有色金属学报》2017年03期

【摘要】：由水热-共还原法制备出的原位共生W-25Cu复合粉末,经冷等静压、真空热压联合包套挤压工艺获得相对密度大于98%,导电率为42.7%IACS,硬度为246HB的高致密细晶W-25Cu电触头材料。材料显微组织中W相和Cu相分布均匀,颗粒细小(1~3μm)。在JF04C型电接触试验机上进行电接触实验,研究其在直流、阻性负载条件下的电接触性能。结果表明:提高钨铜合金致密度、细化晶粒可以减小并稳定接触电阻;燃弧时间和燃弧能量均随电压的增大而增大,分断过程燃弧能量和燃弧时间均小于闭合过程燃弧时间和能量。W-25Cu电触头材料经电侵蚀后,材料表面主要由Cu、W和WO_3三相组成。电接触过程中发生的材料转移以熔桥转移、电弧转移和喷溅蒸发等形式为主;随着电压的增大,发生材料转移方向的转变,即由阴极转移变为阳极转移。
[Abstract]:The in-situ symbiotic W-25Cu composite powder prepared by hydrothermal co-reduction method was prepared by cold isostatic pressing and vacuum hot pressing combined with cladding extrusion process. The relative density was greater than 98, the conductivity was 42.7 IACSs, and the hardness was 246HB. The high density fine crystal W-25Cu contact material was obtained. The W phase and Cu phase are uniformly distributed in the microstructure of the material, and the particle size is 1 ~ 1 渭 m ~ (3) 渭 m ~ (-1). The electrical contact performance under DC and resistive load was studied by electrical contact test on JF04C electric contact tester. The results show that the contact resistance can be reduced and stabilized by increasing the density of tungsten and copper alloy, and the arc burning time and arc energy increase with the increase of voltage. The arc burning energy and arc burning time of breaking process are smaller than that of closed arc burning time and energy. After electric erosion, the surface of the contact material is mainly composed of CuW and WO_3. In the process of electric contact the material transfer is mainly in the form of fusion bridge transfer arc transfer and spatter evaporation. With the increase of voltage the material transfer direction changes from cathode transfer to anode transfer.
【作者单位】：河南科技大学材料科学与工程学院;河南省有色金属共性技术协同创新中心;河南省耐磨材料工程技术研究中心;
【基金】：河南省重点科技攻关项目(111100910500) 河南省教育厅自然科学研究项目(2010A430004)~~
【分类号】：TM503.5;TG146.411

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