金属陶瓷与钢的钎焊连接技术研究

发布时间：2018-04-30 10:27

  本文选题：Ti(C + N)基金属陶瓷　； 参考：《南京航空航天大学》2016年硕士论文

【摘要】：本文采用铜基钎料,实现Ti(C,N)基金属陶瓷和Mo2FeB2基金属陶瓷与45钢的真空钎焊连接,研究了钎焊工艺参数对接头的剪切强度的影响规律,并采用X射线衍射(XRD)、扫描电子显微镜(SEM)、能谱分析仪(EDS)等实验分析手段研究了Ti(C,N)基金属陶瓷/铜基钎料/45钢、Mo2FeB2基金属陶瓷/铜基钎料/45钢钎焊接头的界面产物和显微组织形貌以及元素分布。本文首先综述了金属陶瓷的研究进展及其应用前景和近二十年金属陶瓷与钢连接技术的研究进展,并介绍了各种连接技术优缺点,同时介绍常用钎料的性能与优缺点,在此基础上提出本文的研究目的和意义。采用自制铜基钎料,真空钎焊连接Ti(C,N)基金属陶瓷与钢,研究了主要工艺参数对接头剪切强度和显微组织的影响规律。最优工艺参数为1060℃和10min,此时,接头剪切强度达到195.3MPa,同时,在钎料与母材界面处形成一定厚度的扩散层,其中主要物相为(Cu,Ni)固溶体和(Fe,Ni)固溶体。首次研究Mo2FeB2基金属陶瓷与45钢的真空钎焊连接,结果发现,钎焊温度和保温时间对接头剪切强度的影响呈现抛物线型,在工艺参数为1020℃和20min时接头剪切强度达到240.5MPa,金属陶瓷粘结相向钎料层扩散,抑制钎料中元素扩散,并且降低金属陶瓷近钎料一侧的强度,是导致接头剪切强度下降的原因之一。在自制铜基钎料的基础上,开发出多元合金铜基钎料,采用多元合金铜基钎料真空钎焊连接金属陶瓷与45钢,Ti(C,N)基金属陶瓷和Mo2FeB2基金属陶瓷与45钢的钎焊接头剪切强度分别提高到270.4MPa和275.7MPa,最优钎焊温度相应提高20℃。调整铜基钎料合金元素含量后,铜基钎料与两侧母材的元素扩散增强,钎焊接头剪切强度和使用温度提高,最后探索了金属陶瓷与钢的钎焊连接机理。
[Abstract]:In this paper, the vacuum brazing of TiCn-based cermet and Mo2FeB2 base cermet with 45 steel is realized by using copper based solder. The influence of brazing process parameters on the shear strength of the joint is studied. The interfacial products and the display of TiCn-based cermet / copper-base brazing metal / 45 steel / Mo2FeB2 cermet / copper-base brazing joint were studied by means of X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive analyzer (EDS), and the interfacial products of the brazed joints were studied by means of X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive analysis (EDS). The morphology of microstructures and the distribution of elements. In this paper, the research progress and application prospect of cermet and the research progress of cermet and steel connection technology in recent 20 years are reviewed, and the advantages and disadvantages of various bonding technologies are introduced, and the properties, advantages and disadvantages of common brazing metals are also introduced. On this basis, the purpose and significance of this paper are put forward. The effect of main technological parameters on the shear strength and microstructure of the joints was studied by using a self-made copper base solder and vacuum brazing to connect TiCn-based cermet and steel. The optimum technological parameters are 1060 鈩，

本文编号：1824191