Ni-Cu低温TLP扩散连接接头组织及性能

发布时间：2018-05-04 20:44

  本文选题：Ni-Cu异种金属材料 + 低温TLP扩散连接　； 参考：《焊接学报》2017年10期

【摘要】：采用厚度40μm的纯锡钎料中间层在镍和铜基板间实现了低温瞬态液相扩散连接(transient liquid phase bonding,TLP Bonding),通过延长等温反应时间,获得了完全由(Cu,Ni)6Sn5和Cu3Sn两种金属间化合物相(intermetallic compounds,IMCs)组成的焊接接头.在Ni-Cu TLP扩散连接液-固反应过程中,Sn/Ni和Sn/Cu界面处均形成了(Cu,Ni)6Sn5,但晶粒形貌存在差异,从镍侧到铜侧化合物形貌依次是小颗粒状、针状和扇贝状.此外,Cu3Sn的生长受到了抑制.该IMCs接头具有418.4℃的重熔温度和49.8 MPa的平均抗剪强度,能够满足高温功率器件封装中对耐高温互连的需求,并且有助于提高电子器件在恶劣条件下服役时的可靠性.
[Abstract]:Transient liquid phase bonding and TLP bonding between nickel and copper substrates were realized by using 40 渭 m thickness pure tin filler metal interlayer. By prolonging the isothermal reaction time, a welding joint composed of intermetallic metal compoundsIMCsof two kinds of intermetallic compounds, CuCuPNiNi6Sn5 and Cu3Sn, was obtained by prolonging the isothermal reaction time. In the process of liquid-solid reaction of Ni-Cu TLP diffusion bonding, Ni-Cu TLP / Ni / Ni and Sn/Cu interface were formed, but the grain morphology was different, from nickel side to copper side, the morphologies of compounds were small granular, acicular and scallop. In addition, the growth of Cu3Sn was inhibited. The IMCs joint has a remelting temperature of 418.4 鈩，

本文编号：1844581