双相层状复合Cu-24%Ag合金的组织与性能

发布时间：2018-05-11 23:21

本文选题：Cu-Ag合金 + 显微组织　；参考：《稀有金属材料与工程》2017年09期

【摘要】：采用冷轧和时效工艺制备了Cu-24%Ag(质量分数)合金板材,研究了轧制过程中合金组织与性能的演变规律,讨论了合金强化和电导率与组织变化的关系。剧烈的轧制变形后,合金组织演变成Cu基体和Ag相交替排列的纳米层状结构,Cu基体中包含大量细小的Ag析出相纤维,一些Ag层区域分布着(Cu+Ag)共晶体。当变形至94%左右时,纵截面组织出现剪切带。随变形量增大,Cu基体和Ag层之间的相界面间距、Ag析出相纤维间距和共晶体片层间距均逐渐减小至几十纳米,强化效应显著增强,使合金的硬度在变形量大于96%时急剧增大。建立了Cu/Ag界面引起的电阻率增幅与变形量的关系,可以反映轧制变形引起的组织细化对合金电导率的影响规律。
[Abstract]:Cu-24 Ag-based alloy sheet was prepared by cold rolling and aging process. The evolution of microstructure and properties during rolling was studied, and the relationship between alloy strengthening, electrical conductivity and microstructure was discussed. After severe rolling deformation, the microstructure of the alloy evolved into Cu matrix and Ag phase alternately arranged nanoscale structure Cu matrix containing a large number of fine Ag precipitated phase fibers, and some Ag layers were distributed in Cu Ag eutectic. When the deformation is about 94%, the shear band appears in the longitudinal section. With the increase of deformation amount, the interphase spacing between Cu matrix and Ag layer decreases gradually to dozens of nanometers, and the hardness of the alloy increases sharply when the deformation amount is greater than 96. The relationship between the increase of resistivity caused by Cu/Ag interface and the amount of deformation is established, which can reflect the effect of microstructure refinement caused by rolling deformation on the electrical conductivity of the alloy.
【作者单位】：北京有色金属研究总院;
【基金】：国家自然科学基金(51401026)
【分类号】：TG146.11

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