纳晶铜晶粒尺寸对热导率的影响

发布时间：2018-05-28 09:45

  本文选题：纳晶铜 + 热导率　； 参考：《物理学报》2016年10期

【摘要】：用热压烧结法制备得到纳晶铜块体.用激光法测定了不同温度下制备得到的纳晶铜块体的热导率,并建立卡皮查热阻模型对样品热导率进行模拟.通过对比,模拟结果与实验数据基本一致.随着热压烧结温度的升高,纳晶铜晶粒尺寸也随之增大.在900和700?C其热导率分别达到了最大和最小值且所对应的热导率分别为200.63和233.37 W·m~(-1)·K~(-1),各占粗晶铜块体热导率的53.4%和60.6%.验证了纳晶铜热导率在一定的晶粒尺寸范围内具有尺寸效应,随着晶粒尺寸的减小,热导率逐渐减小.
[Abstract]:Nanocrystalline copper blocks were prepared by hot pressing sintering. The thermal conductivity of nanocrystalline copper bulk prepared at different temperatures was measured by laser method, and the thermal conductivity of the sample was simulated by using the Kapicha thermal resistance model. By comparison, the simulation results are basically consistent with the experimental data. The grain size of nanocrystalline copper increases with the increase of hot pressing sintering temperature. The maximum and minimum thermal conductivities are obtained at 900 and 700 鈩，

本文编号：1946229