Sn-Bi-In低温无铅钎料的组织和性能

发布时间：2018-06-28 04:24

  本文选题：Sn-Bi-In + 显微组织　； 参考：《稀有金属材料与工程》2017年10期

【摘要】：研究了Sn-Bi-In钎料的微观组织、热学特性、润湿性能以及力学性能随合金成分的变化特点。结果表明:Sn-Bi-In钎料的显微组织含有β-Sn相、Bi相以及InBi中间相,Bi含量的减少会导致Bi相和InBi相所占比例降低;钎料DSC曲线中存在3个不同大小的吸热峰,所有合金熔化开始温度在101.3~103.4℃之间,随着Sn含量的增加,钎料的熔程先减小后增大,铺展面积先增大后减小;钎料的显微硬度随着Bi含量的增加而增大,且In的添加使钎料的硬度明显高于Sn-Bi共晶合金;钎料的抗拉强度和断后伸长率随着Bi含量的增大而降低。
[Abstract]:The microstructure, thermal properties, wettability and mechanical properties of Sn-Bi-In solder were studied. The results show that the proportion of Bi phase and InBi phase decreases due to the decrease of the content of 尾 -Sn phase and InBi phase in the microstructure of the filler metal, and there are three endothermic peaks in the DSC curve of the solder. With the increase of Sn content, the melting range of the solder decreases first and then increases, the spreading area increases first and then decreases, and the microhardness increases with the increase of Bi content, and the melting start temperature of all alloys is between 101.3 鈩，

本文编号：2076721