脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究

发布时间：2018-07-01 19:58

本文选题：纳米铜颗粒 + 脉冲电流烧结　；参考：《机械工程学报》2017年04期

【摘要】：利用液相法合成均径为57.5 nm的纳米铜颗粒,并对纳米铜颗粒进行系统的表征,包括有扫描电子显微镜(Scanning electron microscope,SEM)、透射电子显微镜(Transmission electron microscope,TEM)、X射线衍射(X-ray diffraction,XRD)以及热重分析(Thermal gravity analysis,TGA)和差热分析(Differential thermal analysis,DTA),并利用超声手段将纳米铜颗粒均匀分散在水溶液中,从而得到了纳米铜焊膏。采取模板印刷的方法制备镍/纳米铜焊膏/铜的三明治结构,并研究不同脉冲电流烧结工艺下的三明治结构的剪切强度、截面微结构以及断口微结构特征。试验结果表明三明治结构的剪切强度随着电流的增加而增大,在电流为0.8 k A时,剪切强度可达到46.3 MPa,脉冲电流烧结纳米铜焊膏连接铜和镍基板在短时间(小于200 ms)内快速获得了高致密度、性能优良的焊点结构,同时纳米铜颗粒之间以及纳米铜颗粒与微米级的铜基板和镍基板之间实现了牢固的冶金连接。通过分析经脉冲电流烧结后得到的纳米铜焊膏内部的显微组织特征,提出了脉冲电流烧结纳米铜焊膏的烧结机理。
[Abstract]:Nanocrystalline copper particles with an average diameter of 57.5 nm were synthesized by liquid phase method and characterized systematically. It includes scanning electron microscopeSEM, transmission electron microscopeTem, X-ray diffraction (XRD), thermogravimetric analysis (TGA) and differential thermal analysis (DTA). The nano-brazing paste was obtained. The sandwich structure of nickel / nano-copper solder paste / copper was prepared by template printing, and the shear strength, cross-section microstructure and fracture microstructure of sandwich structure were studied under different pulse current sintering processes. The experimental results show that the shear strength of sandwich structure increases with the increase of current, and when the current is 0.8 Ka, the shear strength of sandwich structure increases with the increase of current. The shear strength can reach 46.3 MPA. The high density and excellent solder joint structure are obtained in short time (less than 200 Ms) by pulse current sintered nano-copper solder paste connecting copper and nickel substrate. At the same time, strong metallurgical connections were realized between nano-copper particles and micron copper substrates and nickel substrates. The sintering mechanism of nanocrystalline copper solder paste obtained by pulse current sintering was put forward by analyzing the microstructure of nanocrystalline copper solder paste after pulse current sintering.
【作者单位】：哈尔滨工业大学先进焊接与连接国家重点实验室;
【基金】：国家自然科学基金资助项目(51522503)
【分类号】：TN16;TG457.13

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