超高纯CuMn合金材料微观组织和织构演变研究

发布时间：2018-07-12 15:11

本文选题：铜锰合金 + 溅射靶材　；参考：《稀有金属》2017年02期

【摘要】：当前超大规模集成电路(ULSI)的特征尺寸已经步入纳米范围,随着特征尺寸的减小,铜互连面临着严重的可靠性问题,采用合金化手段可有效抑制晶界附近的电迁移。因而本文主要研究超高纯铜锰合金材料,通过金相(OM)、电子背散射衍射(EBSD)等分析手段研究超高纯铜锰合金材料塑性形变过程和热处理过程中铜锰合金试样的微观组织变化和轧制、再结晶织构变化。实验结果表明:经过对塑性变形试样的分析后发现,试样微观组织主要由许多破碎的小晶粒及亚晶组成,同时试样中存在典型的轧制织构并且存在大量的小角度晶界。经过退火热处理后,试样的微观组织比较均匀,晶粒细小,晶粒尺寸大约为10.7μm;典型轧制织构组分下降比较明显,典型再结晶织构组分上升,但大部分晶粒处于随机取向,试样退火热处理后几乎全部为大角度晶界。
[Abstract]:At present, the characteristic size of ULSI has stepped into the nanometer range. With the reduction of characteristic size, copper interconnection faces serious reliability problems. The electromigration near grain boundaries can be effectively restrained by alloying. In this paper, the microstructure changes and rolling of ultrapure Cu-Mn alloy samples during plastic deformation and heat treatment are studied by means of metallography (OM) and electron backscatter diffraction (EBSD). Recrystallization texture change. The experimental results show that the microstructure of the specimens is mainly composed of many broken small grains and sub-grains, and there are typical rolling texture and a large number of small angle grain boundaries. After annealing and heat treatment, the microstructure of the sample is more uniform, the grain size is about 10.7 渭 m, the typical rolling texture component decreases more obviously, the typical recrystallization texture component increases, but most of the grains are randomly oriented. Almost all samples are large angle grain boundaries after annealing and heat treatment.
【作者单位】：北京有色金属研究总院有研亿金新材料有限公司北京市高纯金属溅射靶材工程技术研究中心;
【基金】：北京市科技新星项目(Z1511000003150102)资助
【分类号】：TN405.97;TG146.11

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