一种基于SEM在线纳米切削的切削力检测方法
发布时间：2018-07-17 22:29
【摘要】：针对纳米切削中实时检测切削力的难题,提出了基于扫描电镜(SEM)原位纳米切削平台,实时检测刀杆挠度变化的有效方法.通过视频采集切削过程,对视频进行分帧处理得到刀具切削过程的图片.选取特征图像,进行去噪、滤波、二值化、腐蚀及边缘提取等图像处理后,提取各帧图像刀具区域目标点像素信息,计算得到刀杆挠度的变化.将刀杆挠度值与有限元仿真所推得的力与挠度的关系相结合,定量给出挠度与切削力的数据,获得单晶硅切削中切削力的大小及波动情况,解决了SEM原位纳米切削加工平台的切削力实时检测难题,为分析实际加工中刀具变形行为以及材料切削特性提供了理论依据.
[Abstract]:Aiming at the difficult problem of real-time measuring cutting force in nano-cutting, an effective method of real-time detecting the deflection of cutter rod based on scanning electron microscope (SEM) in-situ nano-cutting platform is proposed. The cutting process of the cutting tool is obtained by the video capture and cutting process, and the video is divided into frames. After image processing such as denoising, filtering, binarization, etch and edge extraction, the pixel information of the cutter region of each frame is extracted, and the deflection of the tool rod is calculated. Combining the deflection value of tool rod with the relation between force and deflection obtained by finite element simulation, the data of deflection and cutting force are given quantitatively, and the magnitude and fluctuation of cutting force in single crystal silicon cutting are obtained. The problem of real time measuring of cutting force in SEM in situ machining platform is solved, which provides a theoretical basis for analyzing the deformation behavior of cutting tools and the cutting characteristics of materials in practical machining.
【作者单位】： 天津大学精密仪器与光电子工程学院;华为北京研究所;
【基金】：国家自然科学基金资助项目(51575389) 天津市自然科学基金资助项目(15JCYBJC19400)~~
【分类号】：TG501.3;TP391.41
本文编号：2131126
[Abstract]:Aiming at the difficult problem of real-time measuring cutting force in nano-cutting, an effective method of real-time detecting the deflection of cutter rod based on scanning electron microscope (SEM) in-situ nano-cutting platform is proposed. The cutting process of the cutting tool is obtained by the video capture and cutting process, and the video is divided into frames. After image processing such as denoising, filtering, binarization, etch and edge extraction, the pixel information of the cutter region of each frame is extracted, and the deflection of the tool rod is calculated. Combining the deflection value of tool rod with the relation between force and deflection obtained by finite element simulation, the data of deflection and cutting force are given quantitatively, and the magnitude and fluctuation of cutting force in single crystal silicon cutting are obtained. The problem of real time measuring of cutting force in SEM in situ machining platform is solved, which provides a theoretical basis for analyzing the deformation behavior of cutting tools and the cutting characteristics of materials in practical machining.
【作者单位】： 天津大学精密仪器与光电子工程学院;华为北京研究所;
【基金】：国家自然科学基金资助项目(51575389) 天津市自然科学基金资助项目(15JCYBJC19400)~~
【分类号】：TG501.3;TP391.41
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