YIG陶瓷与Cu的连接工艺及机理研究
发布时间：2018-07-18 09:19
【摘要】：钇铁石榴石铁氧体(YIG)作为一种典型的微波铁氧体,常用于雷达、微波通讯、导弹等领域。在实际应用中,YIG陶瓷常需要与Cu进行连接,本文提出了先对YIG陶瓷进行表面金属化处理,再对Cu/金属化YIG进行钎焊实现连接。研究了CuO含量、钎焊温度及保温时间对Ag-CuO钎料在YIG陶瓷表面润湿的影响,YIG陶瓷颗粒含量对金属化层微观组织的影响。YIG陶瓷颗粒含量、钎焊温度及保温时间对Cu/金属化YIG接头组织和力学性能的影响,分析了陶瓷表面金属化机理和钎焊接头形成机理。CuO含量的增加、钎焊温度的升高和保温时间的延长均可提高Ag-CuO钎料在YIG表面的润湿性,CuO与YIG陶瓷反应生成CuFe_2O_4,提高钎料的润湿性。YIG陶瓷表面金属化结构的典型组织为:Ag+CuO+CuFe_2O_4/YIG。综合考虑各因素的影响,确定了钎料配比为Ag-7.5CuO,表面金属化的工艺参数为:钎焊温度为1040℃,保温时间为20min。YIG陶瓷颗粒的加入大大改善了Ag-CuO钎料润湿性,增加CuFe_2O_4产量,可得到表面平整可进行间接钎焊的金属化层。使用Ag-7.5CuO/5YIG复合钎料时,YIG陶瓷表面金属化结构的典型组织为:Ag+Y_3Fe_5O_(12)+CuO+CuFe_2O_4/YIG。钎料中YIG陶瓷颗粒含量的增加,导致金属化层中YIG和CuFe_2O_4相增多,金属化层表面平整度下降。向Ag7.5CuO/5YIG复合钎料加入1%TiO_2时,可生成更多的CuFe_2O_4相,并在金属化层/YIG界面附近富集。使用Sn-3.5Ag-0.75Cu钎料完成了金属化YIG陶瓷/Cu的钎焊连接,钎料与母材Cu及金属化层发生界面反应,得到的钎焊接头典型微观组织为:Cu/Cu_3Sn/Cu_6Sn_5/Sn+Ag_3Sn+Cu_6Sn_5/Ag_3Sn/Ag+Y_3Fe_5O_(12)+CuO+CuFe_2O_4/YIG。随着YIG含量的增加,焊缝中YIG和CuFe_2O_4相增多,接头剪切强度随YIG含量增加而减小。钎焊温度的升高和保温时间的延长会使Sn基固溶体两侧的反应层增厚。随着钎焊温度升高,接头剪切强度先增加后减小。而随着保温时间的延长,接头剪切强度随着下降。当复合钎料中YIG含量为5%,钎焊温度为270℃,保温时间为1min时,获得最高接头剪切强度,为28.7MPa。向复合钎料中加入少量TiO_2后,改变了YIG陶瓷颗粒在焊缝中分布情况,提高了接头力学性能。
[Abstract]:Yttrium iron garnet ferrite (YIG), as a typical microwave ferrite, is often used in radar, microwave communication, missile and other fields. In practical application, YIG ceramics often need to be connected with Cu. In this paper, surface metallization of YIG ceramics and brazing of Cu / metallized YIG ceramics are proposed. The effects of CuO content, brazing temperature and holding time on the wettability of Ag-CuO solder on YIG ceramic surface were studied. The effects of brazing temperature and holding time on the microstructure and mechanical properties of Cu / metallized YIG joints were investigated. The wettability of Ag-CuO solder on YIG surface can be increased with the increase of brazing temperature and the prolongation of holding time. CuFe2O4 is formed by the reaction of CuO and YIG ceramics. The typical structure of the metallized structure on the surface of YIG ceramics is: 1% Ag CuO CuFe2O2O4 / YIG0.The typical structure for improving the wettability of the filler metal is: 1% Ag CuO CuFe2O4. Considering the influence of various factors, it is determined that the ratio of solder is Ag-7.5CuO, and the technological parameters of surface metallization are as follows: brazing temperature is 1040 鈩，
本文编号：2131459
[Abstract]:Yttrium iron garnet ferrite (YIG), as a typical microwave ferrite, is often used in radar, microwave communication, missile and other fields. In practical application, YIG ceramics often need to be connected with Cu. In this paper, surface metallization of YIG ceramics and brazing of Cu / metallized YIG ceramics are proposed. The effects of CuO content, brazing temperature and holding time on the wettability of Ag-CuO solder on YIG ceramic surface were studied. The effects of brazing temperature and holding time on the microstructure and mechanical properties of Cu / metallized YIG joints were investigated. The wettability of Ag-CuO solder on YIG surface can be increased with the increase of brazing temperature and the prolongation of holding time. CuFe2O4 is formed by the reaction of CuO and YIG ceramics. The typical structure of the metallized structure on the surface of YIG ceramics is: 1% Ag CuO CuFe2O2O4 / YIG0.The typical structure for improving the wettability of the filler metal is: 1% Ag CuO CuFe2O4. Considering the influence of various factors, it is determined that the ratio of solder is Ag-7.5CuO, and the technological parameters of surface metallization are as follows: brazing temperature is 1040 鈩，
本文编号：2131459
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