多层晶片阳极键合界面结构及力学性能研究

发布时间：2018-07-21 14:21

【摘要】：BF玻璃具有良好的耐热性能、光学性能、化学稳定性以及力学性能,在MEMS器件制造和封装领域常作为基体材料与半导体、金属等材料进行连接以实现对微传感器、微流泵等器件的封装工艺。阳极键合是实现玻璃与上述几种材料连接最常用的技术,本文利用阳极键合技术,通过电场反转实现了Si-glass-Si、Al-glass-Al、Al-glass-Si的连接;通过钎料在大气低温下实现了glass-Ni的连接,研究了工艺参数对界面结构和力学性能的影响,研究发现:(1)利用阳极键合工艺,通过一次电场反转可实现Si-glass-Si的连接,Si(1)-glass键合过程中,由于Na+在玻璃表面析出,导致连接界面附近的玻璃体内形成Na+耗尽层,Na+耗尽层中存在“高场强”和“低场强”两个不同的空间区域。受第一个键合界面的影响,Si(2)-glass界面键合过程中出现两个峰值电流。(2)利用阳极键合技术制备了Al-glass-Al和Al-glass-Si试样。由于Al3+扩散至Na+耗尽层,第二个界面键合电流并未出现两个峰值电流。反向电场会降低Al(1)-glass界面键合率,但不会破坏其界面。Al-glass-Al界面强度高于Al-glass-Si界面强度,且断裂均沿第二次键合界面发生。(3)首次利用Al箔作过渡层,在大气中实现了glass与Ni的低温钎焊连接,典型的界面结构为:glass/Al/Al_8ZnSn_4+solder/Ni_3Sn_2/Ni。拉伸试验结果表明,断裂发生在玻璃处,说明界面结合良好,界面强度超过母材的强度。
[Abstract]:BF glass has good heat resistance, optical properties, chemical stability and mechanical properties. In the field of MEMS device fabrication and packaging, BF glass is usually connected to semiconductor, metal and other materials in order to realize the microsensor. Packaging technology of microflow pump and other devices. Anodic bonding is the most commonly used technique to connect glass with the above mentioned materials. In this paper, the connection of Si-glass-Si-Al-glass-Si and glass-Ni at low temperature in atmosphere is realized by means of anode bonding technique and electric field inversion. The effects of process parameters on interface structure and mechanical properties are studied. It is found that: (1) by using anodic bonding process, the bonding process of Si-glass-Si (1) -glass can be realized by a single electric field inversion, and Na precipitates on the glass surface. The formation of Na depletion layer in vitreous near the junction interface has two different spatial regions, "high field intensity" and "low field intensity". Two peak currents occurred in the bonding process of Si (2) -glass interface under the influence of the first bonding interface. (2) Al-glass-Al and Al-glass-Si samples were prepared by anodic bonding technique. As Al3 diffuses to the Na depletion layer, the second interface bond current does not show two peak currents. The reverse electric field decreases the bonding rate of Al (1) -glass interface, but does not destroy the interfacial strength of Al-glass-Al interface, which is higher than that of Al-glass-Si interface, and the fracture occurs along the second bonding interface. (3) Al foil is used as the transition layer for the first time. The low temperature brazing bonding between glass and Ni is realized in the atmosphere. The typical interface structure is: 1 / glass / Al / Al\ +\ {8ZnSn\}\% Ni3Sn2 / Ni. The tensile test results show that the fracture occurs in the glass, indicating that the interface bond is good, and the interface strength is higher than the strength of the base metal.
【学位授予单位】：太原理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TH-39;TG454

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