CuCr真空触头材料的制备及其组织与性能的研究
发布时间：2018-08-07 10:58
【摘要】：近年来,随着国家电力技术的进步,我国真空开关有了飞跃的发展,对其核心部件触头材料提出了更高的要求,CuCr触头材料是目前国内外真空开关的首选材料,需开发研制新型CuCr触头材料,以满足更严苛环境下的使用要求。研究发现CuCr合金的微观特性对其宏观性能有重要的影响。目前,改善CuCr触头材料组织性能的主要方法有:1.添加新组元,优化合金成分;2.改进和采用新工艺;3.后续加工及热处理。本论文采用高能预球磨细化Cr粉,并利用先进的热等静压技术制备CuCr触头材料,添加Zr和TiC,并后续进行固溶时效热处理,研究Cr颗粒尺寸、添加组元和热处理对CuCr触头材料微观组织、维氏硬度、电导率、机械强度和真空电击穿性能的影响。通过分析CuCr触头材料的组织及性能可知:采用100(TC*120MPaa*2h热等静压固相烧结工艺可成功制备不同Cr颗粒尺寸接近完全致密的CuCr触头材料,合金的组织均匀致密,物相纯净。添加的Zr存在于Cu基体,并在Cu/Cr界面富集,改善Cu与Cr的烧结性;添加的TiC存在于Cu基体中,填充Cu与Cr的间隙。结果表明:添加TiC组元,合金的机械性能增加,电导率略有降低;随着Cr颗粒尺寸的减小,合金的机械性能提高,电导率有一定程度的降低;采用960℃*1h+50℃*4h固溶时效工艺,合金的机械性能明显提高,电导率有一定程度的回升。对CuCr触头材料的电击穿烧蚀研究表明,其电击穿发生在富Cr相及富Cr相与富Cu相的边界。减小Cr颗粒尺寸,电击穿也会发生在富Cu相上,CuCr合金耐电压强度提高,截流值降低,电弧寿命略有延长。添加TiC,电击穿发生在电子逸出功较低的TiC上以及TiC/Cu相界面处,电弧得到有效的分散,合金耐电压强度提高,截流值降低,电弧寿命延长;经过固溶时效处理,合金烧蚀区域较分散,耐电压强度提高,截流值降低,电弧寿命延长。CuCr29Zr1(Cr76μm)合金的相对电导率为44.76%IACS,抗拉强度357.0MPa,耐电压强度5.38×107V/m,截流值为4.04A;CuCr28Zr1TiCl(Cr76μm)合金相对电导率为40.17%IACS,抗拉强度达到374.3MPa,耐电压强度7.69×107V/m,截流值为3.80A;CuCr28Zr1TiCl(Cr10-15μm)合金相对电导率为 33.60%IACS,抗拉强度达到 400.7MPa,耐电压强度12.6×107V/m,截流值为3.14A。
[Abstract]:In recent years, with the progress of national power technology, the vacuum switch in China has made a leap development. A higher requirement for the contact material of its core component is put forward. CuCr contact material is the first choice material of vacuum switch at home and abroad at present. A new type of CuCr contact material should be developed to meet the requirements of more severe environment. It is found that the microcosmic properties of CuCr alloys have an important effect on their macroscopic properties. At present, the main methods to improve the microstructure and properties of CuCr contact materials are: 1. 1. Adding new component to optimize alloy composition. Improve and adopt the new process. Follow-up processing and heat treatment. In this paper, Cr powder was refined by high-energy pre-milling, and CuCr contact materials were prepared by advanced hot isostatic pressing technology, Zr and tic were added, and the grain size of Cr was studied by solution aging heat treatment. Effects of addition and heat treatment on microstructure, Vickers hardness, electrical conductivity, mechanical strength and vacuum breakdown properties of CuCr contact materials. By analyzing the microstructure and properties of CuCr contact materials, it can be concluded that CuCr contact materials with different Cr particle sizes close to complete density can be successfully prepared by using 100 (TC*120MPaa*2h) hot isostatic pressure solid-state sintering process. The microstructure of the alloy is uniform and dense, and the phase is pure. The addition of Zr exists in Cu matrix and is enriched at the interface of Cu/Cr to improve the sintering properties of Cu and Cr, and the added TiC exists in Cu matrix to fill the gap between Cu and Cr. The results showed that the mechanical properties of the alloy increased and the electrical conductivity decreased slightly with the addition of TiC component, and the mechanical properties of the alloy increased with the decrease of Cr particle size, the electrical conductivity decreased to a certain extent, and the process of solution aging at 960 鈩，
本文编号：2169809
[Abstract]:In recent years, with the progress of national power technology, the vacuum switch in China has made a leap development. A higher requirement for the contact material of its core component is put forward. CuCr contact material is the first choice material of vacuum switch at home and abroad at present. A new type of CuCr contact material should be developed to meet the requirements of more severe environment. It is found that the microcosmic properties of CuCr alloys have an important effect on their macroscopic properties. At present, the main methods to improve the microstructure and properties of CuCr contact materials are: 1. 1. Adding new component to optimize alloy composition. Improve and adopt the new process. Follow-up processing and heat treatment. In this paper, Cr powder was refined by high-energy pre-milling, and CuCr contact materials were prepared by advanced hot isostatic pressing technology, Zr and tic were added, and the grain size of Cr was studied by solution aging heat treatment. Effects of addition and heat treatment on microstructure, Vickers hardness, electrical conductivity, mechanical strength and vacuum breakdown properties of CuCr contact materials. By analyzing the microstructure and properties of CuCr contact materials, it can be concluded that CuCr contact materials with different Cr particle sizes close to complete density can be successfully prepared by using 100 (TC*120MPaa*2h) hot isostatic pressure solid-state sintering process. The microstructure of the alloy is uniform and dense, and the phase is pure. The addition of Zr exists in Cu matrix and is enriched at the interface of Cu/Cr to improve the sintering properties of Cu and Cr, and the added TiC exists in Cu matrix to fill the gap between Cu and Cr. The results showed that the mechanical properties of the alloy increased and the electrical conductivity decreased slightly with the addition of TiC component, and the mechanical properties of the alloy increased with the decrease of Cr particle size, the electrical conductivity decreased to a certain extent, and the process of solution aging at 960 鈩，
本文编号：2169809
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