Cu-Ni-Sn扩散偶的界面过渡层固相序列分析
发布时间：2018-09-03 06:26
【摘要】：铍铜合金性能优异,但潜存毒性危害,Cu-Ni-Sn合金是一种典型的调幅分解强化型弹性铜合金,凭借其高的强度、硬度、弹性和优良的抗应力松弛性能,广泛应用于电子、航天、航海等领域,是替代铍铜的候选材料之一。然而Cu-Ni-Sn合金体系复杂,不同成分合金的性能差异较大,传统的研究材料的方法,一次只能研究一种或几种成分的合金,因此本文选择了"扩散多元节"高通量实验方法对Cu-Ni-Sn合金进行研究。本文采用CALPHAD相图计算手段,计算了Cu,Ni和Sn元素在相变过程中的活度变化曲线,根据元素活度在合金相中的范围大小对Cu-Ni-Sn三元扩散偶的Cu-Ni,Cu-Cu35Sn和Ni-Cu35Sn各个界面的固相序列进行了理论优化。通过Cu-Ni-Sn三元扩散偶实验,获得了CuNi,Cu-Cu35Sn和Ni-Cu35Sn扩散界面的过渡层组织形貌,结合理论计算结果,得到了可能的界面固相序列。在650℃条件下,Cu-Ni界面处仅有fcc_A1相的过渡层;Cu-Cu35Sn界面过渡层固相序列自富Cu端为fcc_A1→D03_Cu3Sn/Cu3Sn;Ni-Cu35Sn界面的固相序列自富Ni端为fcc_A1+Ni3Sn_LT→fcc_A1+Ni3Sn2→Ni3Sn2+D03_Cu3Sn/Cu3Sn。
[Abstract]:Beryllium copper alloy has excellent properties, but the latent toxicity of Cu-Ni-Sn alloy is a typical elastic copper alloy strengthened by amplitude modulation decomposition. Due to its high strength, hardness, elasticity and excellent stress relaxation resistance, Cu-Ni-Sn alloy has been widely used in electronics and spaceflight. Navigation is one of the candidate materials to replace beryllium copper. However, the Cu-Ni-Sn alloy system is complex, and the properties of different composition alloys vary greatly. The traditional method of studying materials can only study one or more alloys with one or more components at a time. In this paper, the high-throughput Cu-Ni-Sn alloy was studied by means of diffusion multicomponent node. In this paper, the activity curves of Cu,Ni and Sn elements during phase transition are calculated by means of CALPHAD phase diagram. The solid sequences of Cu-Ni,Cu-Cu35Sn and Ni-Cu35Sn interfaces of Cu-Ni-Sn ternary diffusion couple were optimized theoretically according to the range of element activity in the alloy phase. The morphology of transition layer of CuNi,Cu-Cu35Sn and Ni-Cu35Sn diffusion interface was obtained by Cu-Ni-Sn diffusion couple experiment. Combined with the theoretical results, the possible interfacial solid sequence was obtained. At 650 鈩，
本文编号：2219172
[Abstract]:Beryllium copper alloy has excellent properties, but the latent toxicity of Cu-Ni-Sn alloy is a typical elastic copper alloy strengthened by amplitude modulation decomposition. Due to its high strength, hardness, elasticity and excellent stress relaxation resistance, Cu-Ni-Sn alloy has been widely used in electronics and spaceflight. Navigation is one of the candidate materials to replace beryllium copper. However, the Cu-Ni-Sn alloy system is complex, and the properties of different composition alloys vary greatly. The traditional method of studying materials can only study one or more alloys with one or more components at a time. In this paper, the high-throughput Cu-Ni-Sn alloy was studied by means of diffusion multicomponent node. In this paper, the activity curves of Cu,Ni and Sn elements during phase transition are calculated by means of CALPHAD phase diagram. The solid sequences of Cu-Ni,Cu-Cu35Sn and Ni-Cu35Sn interfaces of Cu-Ni-Sn ternary diffusion couple were optimized theoretically according to the range of element activity in the alloy phase. The morphology of transition layer of CuNi,Cu-Cu35Sn and Ni-Cu35Sn diffusion interface was obtained by Cu-Ni-Sn diffusion couple experiment. Combined with the theoretical results, the possible interfacial solid sequence was obtained. At 650 鈩，
本文编号：2219172
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