Ni-Cu-P化学镀层表面铁细菌污垢特性

发布时间：2018-12-31 19:59

【摘要】：利用化学镀Ni-Cu-P工艺对换热器常用材料低碳钢进行改性,研究Ni-Cu-P镀层表面铁细菌污垢特性。将试样置于铁细菌悬液中进行为期5天的污垢沉积实验,记录Ni-Cu-P镀层表面铁细菌污垢沉积量、腐蚀失重量以及铁细菌生长变化情况,分析铁细菌污垢实验前后镀层表面微观形貌。测试不同时间的极化曲线和电化学阻抗谱,定性分析极化曲线和阻抗谱的变化规律,采用Zsimp Win拟合出最佳等效电路模型。研究结果表明,Ni-Cu-P镀层可以有效抑制微生物污垢生长,与未施镀的碳钢试样对比,Ni-Cu-P改性表面污垢沉积量减少89.1%,表面失重量减少80.2%。Ni-Cu-P镀层自腐蚀电位高于碳钢,自腐蚀电流密度比碳钢小,且容抗弧半径大于碳钢,展现了较好的耐蚀性。铁细菌对Ni-Cu-P镀层的腐蚀速度先减小后增大,在12h腐蚀速度最小。
[Abstract]:Low carbon steel, a common material of heat exchanger, was modified by electroless Ni-Cu-P process, and the characteristics of iron bacterial fouling on the surface of Ni-Cu-P coating were studied. The samples were deposited in the suspension of iron bacteria for 5 days to record the amount of iron bacteria fouling, the weight loss of corrosion and the growth of iron bacteria on the surface of Ni-Cu-P coating. The micromorphology of the coating surface before and after the iron bacterial fouling experiment was analyzed. The polarization curves and electrochemical impedance spectra at different time were measured, and the variation of polarization curves and impedance spectra were qualitatively analyzed. The optimal equivalent circuit model was fitted by Zsimp Win. The results show that Ni-Cu-P coating can effectively inhibit the growth of microbial fouling. Compared with the uncoated carbon steel sample, the amount of fouling deposited on the modified surface of Ni-Cu-P can be reduced by 89.1. The corrosion potential of 80.2%.Ni-Cu-P coating is higher than that of carbon steel, the corrosion current density is smaller than that of carbon steel, and the arc radius of capacitive resistance is larger than that of carbon steel, which shows good corrosion resistance. The corrosion rate of iron bacteria on Ni-Cu-P coating decreases first and then increases, and the corrosion rate is the lowest at 12 h.
【作者单位】：东北电力大学能源与动力工程学院;
【基金】：国家自然科学基金项目(51476025)
【分类号】：TG174.4

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