第二相粒子与织构对高强Cu-Ni-Si系合金薄板各向异性的影响
发布时间：2019-03-02 09:18
【摘要】：利用利用X射线衍射、电子背散射衍射和透射电子显微镜等手段研究了Cu-Ni-Si系合金在不同固溶温度下第二相与织构对其平面各向异性的影响.结果表明:随固溶温度的升高,合金强度和伸长率均出现先升高后降低的趋势,且存在明显的各向异性;800℃固溶时,Cu'和S'为主织构,部分形变晶粒诱发少量Brass、Goss和{011}〈511〉取向的形成,使得合金各向异性减弱;高温固溶时(≥850℃),晶粒发生完全再结晶,Cu'和S'织构强度显著增加,Brass等织构减弱甚至消失,各向异性增强;850℃固溶时效后形成δ-Ni_2Si析出相,并与基体满足[001]_(Cu)//[110]_δ,(010)_(Cu)//(001)_δ位向关系,温度进一步增加,第二相析出体积分数降低,有利于改善材料的各向异性.
[Abstract]:By means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy, the influence of the second phase and texture on the plane anisotropy of Cu-Ni-Si alloy at different solid solution temperatures has been investigated by means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy. The results show that with the increase of solid solution temperature, the strength and elongation of the alloy increase first and then decrease, and there is obvious anisotropy. At 800 鈩，
本文编号：2432915
[Abstract]:By means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy, the influence of the second phase and texture on the plane anisotropy of Cu-Ni-Si alloy at different solid solution temperatures has been investigated by means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy. The results show that with the increase of solid solution temperature, the strength and elongation of the alloy increase first and then decrease, and there is obvious anisotropy. At 800 鈩，
本文编号：2432915
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