无氧铜表面特定清洗液的腐蚀机制及溶液特性

发布时间：2019-05-11 05:24

【摘要】：目的通过无氧铜特定清洗液的溶液配方实验、腐蚀机制测定以及清洗液浓度表征,为实现无氧铜稳定清洗提出技术方案。方法采用铬酐和浓硫酸互配进行溶液配方实验并采用扫描电镜形貌和腐蚀速率对结果进行对比分析;采用电化学循环伏安法研究了铜浓度对腐蚀速率的影响;采用EDTA络合滴定法测定铜浓度和氧化还原滴定法测定六价铬浓度进行了分析。结果 60~80 g/L铬酐+40~60 m L/L硫酸+余量水的溶液清洗可以获得均一稳定的表面,其中铬酐发挥着氧化剂的作用,硫酸发挥着调整酸度的作用;适当的铜离子浓度对化学反应有促进作用,随着铜离子质量浓度增大至5 g/L以上,腐蚀动力减缓,腐蚀速率减慢。结论提出了无氧铜稳定清洗的合适浓度,得出了腐蚀机制及溶液特性的具体结果。
[Abstract]:Objective to propose a technical scheme for stable cleaning of oxygen-free copper through solution formulation experiment, corrosion mechanism determination and concentration characterization of oxygen-free copper. Methods the solution formulation experiment was carried out by the mixture of chromium anhydride and concentrated sulfuric acid, and the results were compared and analyzed by scanning electron microscope (SEM) and corrosion rate, and the effect of copper concentration on corrosion rate was studied by electrochemical cyclic volt-ampere method. Copper concentration was determined by EDTA complexometric titration and hexavalent chromium concentration was determined by redox titration. Results A uniform and stable surface could be obtained by cleaning the solution of 60 脳 80 g 路L chromic anhydride 40 脳 60 mL / L sulfuric acid residual water, in which chromium anhydride played the role of oxidant and sulfuric acid played the role of adjusting acidity. Appropriate copper ion concentration can promote the chemical reaction. With the increase of copper ion concentration above 5 g 路L, the corrosion power slows down and the corrosion rate slows down. Conclusion the suitable concentration of oxygen-free copper cleaning is put forward, and the corrosion mechanism and solution characteristics are obtained.
【作者单位】：西部超导材料科技股份有限公司;超导材料制备国家工程实验室;
【分类号】：TG172

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