时效Ag-7wt.%Cu合金的微观组织、电阻率和硬度
发布时间：2019-05-23 01:40
【摘要】：采用差示扫描量热法、X射线衍射及透射电子显微镜研究了固溶和固溶一冷轧Ag-7wt.%Cu合金在时效过程中富Cu相的析出动力学和形貌特征,同时结合电阻率和显微硬度的测量,定量对比了固溶和固溶一冷轧Ag-7wt.%Cu合金时效过程中富Cu相对电阻率和硬度的影响及其机理.研究结果表明:固溶样品中富Cu相反应温度为300℃-350℃,析出激活能为(111±1.6)kJ/mol;而固溶一冷轧样品中由于形变能的存在,富Cu相温度降低为290℃-330℃,析出激活能升高为(128±12)kJ/mol.XRD结果证实富Cu相的析出过程与时效温度有关.固溶和固溶一冷轧合金在450℃时效后均能观察到球状的富Cu相,富Cu相的析出和溶解过程对电阻率和显微硬度有显著影响.当时效温度低于450℃时,随时效温度的提高,固溶一时效样品的电阻率降低,显微硬度增加:而固溶一冷轧一时效样品的电阻率和显微硬度均逐渐降低.显微硬度除了受富Cu相的影响外,还受到位错和形变孪晶的影响.当时效温度高于450℃时,两种样品的电阻率增大,而显微硬度降低.
[Abstract]:The precipitation kinetics and morphology of Cu-rich phase in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were studied by differential scanning Calorimeter (DSC), X-ray diffraction (XRD) and transmission electron microscope (TEM). At the same time, combined with the measurement of resistance and microhardness, the effects and mechanism of relative resistance and hardness of Cu rich in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were quantitatively compared. The results show that the reaction temperature of Cu rich in solid solution is 300 鈩，
本文编号：2483479
[Abstract]:The precipitation kinetics and morphology of Cu-rich phase in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were studied by differential scanning Calorimeter (DSC), X-ray diffraction (XRD) and transmission electron microscope (TEM). At the same time, combined with the measurement of resistance and microhardness, the effects and mechanism of relative resistance and hardness of Cu rich in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were quantitatively compared. The results show that the reaction temperature of Cu rich in solid solution is 300 鈩，
本文编号：2483479
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