基于超声波辅助的铝合金表面改性工艺研究
发布时间：2019-06-16 13:57
【摘要】：当下,铝合金表面的氧化膜已经成为其更加广泛发展应用的关键制约。工业上常采用电镀的方式对Al合金进行改性,但电镀废液会造成环境污染。超声波在液态钎料中传播过程中会伴随空化和声流效应的形成,这两种效应可以用来击碎Al合金表面的氧化膜,促进液态钎料在Al合金表面润湿铺展,形成冶金结合。Sn基钎料被广泛的应用于电子产业,但Sn-Al之间的互溶度很小,也不会形成冶金结合,阻碍了Al合金在电子产业领域的应用。基于此,采用超声波辅助钎焊法钎焊了1060Al合金,系统的研究了工艺对Sn-Al结合的影响,以及对接头组织性能的影响,并分析了超声波作用下的Sn与Al结合机制。同时采用超声波辅助钎焊法实现在Al合金表面镀覆Sn基钎料,得到最优异的镀覆工艺参数。试验结果表明,温度为300℃,超声作用10 s的条件下,三种Sn钎料均可得到质量良好的接头。纯Sn钎料钎焊接头的组织为α-Al和β-Sn,接头最高剪切强度为38 MPa,接头断裂位置位于界面处,为韧性断裂模式。Sn-9Zn钎料钎焊接头的组织为Sn-9Zn共晶、α-Al及杆状富Zn相,接头最高剪切强度为61 MPa,断裂位置位于焊缝,为韧性断裂。Sn-3Ag钎料钎焊接头组织为Sn-3Ag共晶、α-Al以及Ag2Al,接头最高强度为48 MPa,断裂位置位于焊缝,断裂形式为沿晶断裂。升高温度和增加超声作用时间,均会增加焊缝中的含Al量,提高界面的结合效果,温度为400℃时焊缝中的含Al量为10.03%。Zn元素的加入会促进Sn在Al表面的润湿铺展,促进Sn向母材中的溶解,增强Sn-Al的界面结合。温度为300℃,超声间隔加载12 s,可实现在Al基板表面局部镀覆纯Sn从而实现对Al基板进行表面改性,热风整平工艺可得到平整镀覆Sn层以及平滑过渡的天线焊点。温度为300℃,超声作用10 s可实现在Al基板表面局部镀覆Sn-9Zn层。采用大功率超声波焊机可实现对大面积Al基板全面改性,增加超声功率和延长超声作用时间可以增强表面镀覆效果。Al/Cu回流焊过程中,表面镀覆有纯Sn的Al基板界面结合良好,未发现裂纹及孔洞。
[Abstract]:At present, the oxide film on the surface of aluminum alloy has become the key constraint of its more extensive development and application. Al alloy is often modified by electroplating in industry, but electroplating waste liquid will cause environmental pollution. Ultrasonic wave propagation in liquid solder will be accompanied by cavitation and sound flow effect. These two effects can be used to break the oxide film on the surface of Al alloy, promote the wetting and spreading of liquid solder on the surface of Al alloy, and form metallurgical bonding. SN based solder is widely used in electronic industry, but the mutual solubility between Sn-Al is very small and does not form metallurgical bonding, which hinders the application of Al alloy in the field of electronic industry. Based on this, 1060Al alloy was brazed by ultrasonic assisted brazing. The effect of process on the bonding of Sn-Al and the microstructure and properties of the joint was studied systematically, and the bonding mechanism between Sn and Al under ultrasonic wave was analyzed. At the same time, the Sn base solder was coated on the surface of Al alloy by ultrasonic assisted brazing method, and the best plating process parameters were obtained. The experimental results show that the joints with good quality can be obtained by three kinds of Sn solder under the condition of temperature of 300 鈩，
本文编号：2500613
[Abstract]:At present, the oxide film on the surface of aluminum alloy has become the key constraint of its more extensive development and application. Al alloy is often modified by electroplating in industry, but electroplating waste liquid will cause environmental pollution. Ultrasonic wave propagation in liquid solder will be accompanied by cavitation and sound flow effect. These two effects can be used to break the oxide film on the surface of Al alloy, promote the wetting and spreading of liquid solder on the surface of Al alloy, and form metallurgical bonding. SN based solder is widely used in electronic industry, but the mutual solubility between Sn-Al is very small and does not form metallurgical bonding, which hinders the application of Al alloy in the field of electronic industry. Based on this, 1060Al alloy was brazed by ultrasonic assisted brazing. The effect of process on the bonding of Sn-Al and the microstructure and properties of the joint was studied systematically, and the bonding mechanism between Sn and Al under ultrasonic wave was analyzed. At the same time, the Sn base solder was coated on the surface of Al alloy by ultrasonic assisted brazing method, and the best plating process parameters were obtained. The experimental results show that the joints with good quality can be obtained by three kinds of Sn solder under the condition of temperature of 300 鈩，
本文编号：2500613
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