电迁移诱发镀层锡须生长行为分析

发布时间：2019-06-25 00:22

【摘要】：分析了0.3×10~4A/cm~2恒定电流密度和四种不同加载时间(0,48,144和240 h)电迁移条件对6.5μm厚镀锡层表面锡须生长行为的影响,以及不同电流密度对阴极裂纹宽度的影响.结果表明,电迁移加速了镀层表面锡须的形成与生长,随着电迁移时间的延长,锡须长度不断增加.此外,电迁移导致在阴极首先出现了圆形空洞,随后在两极均形成了圆形空洞,并且在阴极处还发现有微裂纹存在,随着电流密度增加,阴极裂纹宽度也随之增加,电流密度为0.5×10~4A/cm~2时,平均最大裂纹宽度约为9.2μm.
[Abstract]:The effects of 0.3 脳 10 ~ 4A/cm~2 constant current density and four different loading times (0, 48144 and 240h) on the growth behavior of tin whiskers on 6.5 渭 m thick tin plating layer and the effect of different current density on cathode crack width were analyzed. The results show that electromigration accelerates the formation and growth of tin whiskers on the surface of the coating. With the prolongation of electromigration time, the length of tin whiskers increases. In addition, the electromigration results in the first appearance of circular voids in the cathode, followed by the formation of circular voids at the poles, and the existence of microcracks at the cathode. With the increase of current density, the width of cathode cracks also increases. When the current density is 0.5 脳 10~4A/cm~2, the average maximum crack width is about 9.2 渭 m.
【作者单位】：重庆大学机械传动国家重点实验室;重庆科技学院冶金与材料工程学院;哈尔滨工业大学先进焊接与连接国家重点实验室;
【基金】：国家自然科学基金资助项目(51674056) 重庆市前沿与应用基础研究资助项目(cstc2014jcyj A40009) 先进焊接与连接国家重点实验室开放课题研究基金资助项目(AWJ-M15-05) 重庆市高校创新团队建设计划资助项目(CXTDX201601032)
【分类号】：TG174.4

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