TC4钛合金扩散连接工艺研究
发布时间：2019-07-10 11:28
【摘要】：通过正交试验研究了TC4钛合金的真空扩散连接工艺,进行了扩散连接接头的剪切强度试验。通过光学显微镜(OM)、扫描电镜(SEM)等分析手段,研究扩散连接温度、压力、时间等参数对TC4真空扩散连接质量及扩散连接接头剪切强度的影响。结果表明:扩散连接温度920℃,压力3 MPa,保温保压30 min时,扩散连接界面完全与基体相融,局部微孔等缺陷基本消失,孔洞弥合率达到98.63%,扩散连接接头的剪切强度为467.83 MPa,达到了母材剪切强度(480MPa)的97.46%。
[Abstract]:The vacuum diffusion bonding process of TC4 titanium alloy was studied by orthogonal test, and the shear strength test of the diffusion bonding joint was carried out. By means of optical microscope (OM) and scanning electron microscope (SEM), the influence of diffusion bonding temperature, pressure, time and other parameters on the connection quality of the TC4 vacuum diffusion and the shear strength of the diffusion bonding joint was studied. The results show that when the diffusion bonding temperature is 920 鈩，
本文编号：2512572
[Abstract]:The vacuum diffusion bonding process of TC4 titanium alloy was studied by orthogonal test, and the shear strength test of the diffusion bonding joint was carried out. By means of optical microscope (OM) and scanning electron microscope (SEM), the influence of diffusion bonding temperature, pressure, time and other parameters on the connection quality of the TC4 vacuum diffusion and the shear strength of the diffusion bonding joint was studied. The results show that when the diffusion bonding temperature is 920 鈩，
本文编号：2512572
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