UV-LIGA制备金微小零件技术研究

发布时间：2018-02-22 05:42

本文关键词： UV-LIGA 金微小零件冲液电铸过曝光溶胀性　出处：《南京航空航天大学》2012年硕士论文　论文类型：学位论文

【摘要】：由于金具有特殊的物理、化学性能（如优良的可塑性、焊接性、耐腐性、耐热性和导电性等），，因此，被广泛应用于电子元器件、集成电路、PCB板、宇宙空间技术和尖端军事设备。因为金具有良好的延展性，用常规机加工方法难以加工厚度要求在几十微米到几百微米的金微小零件，而基于SU-8光刻胶的UV-LIGA技术是一种低成本制造微零件的方法，利用该技术能够制造出复杂形状的金微小零件。本文进行了UV-LIGA制备金微小零件技术研究，主要的工作如下：（1）提出了采用正向冲液电铸技术进行金微小零件电铸工艺研究，研究了出液口形状、电流密度及阴阳极间距对电铸金微小零件表面质量的影响，获得了优化的电流密度和阴阳极间距。（2）研究了SU-8光刻胶过曝光工艺，分析了过曝光参数对光刻胶模表面线宽的影响，及过曝光参数与光刻胶模形状之间的关系，获得了断面形貌为梯形结构的光刻胶模。（3）通过对SU-8光刻胶在电铸金溶液中溶胀性的研究，总结出SU-8光刻胶在基片约束下的溶胀规律。分析了掩模线宽补偿、降低电铸温度和增设隔离带方式对提高金微小零件尺寸精度的效果。（4）对金微小零件关键尺寸进行了试验研究。采用线宽补偿的掩模板对SU-8光刻胶进行了过曝光试验，研究了过曝光所得的胶模，在溶胀性作用下，对电铸所形成的金微小零件关键部分侧壁的影响。
[Abstract]:Because gold has special physical and chemical properties (such as excellent plasticity, weldability, corrosion resistance, heat resistance and electrical conductivity, etc.), it is widely used in electronic components, integrated circuits, PCB, etc. Space technology and sophisticated military equipment. Because of the good ductility of gold, it is difficult for conventional machining methods to process tiny gold parts whose thickness requires tens to hundreds of microns. The UV-LIGA technology based on SU-8 photoresist is a low cost method to fabricate micro parts, which can be used to fabricate gold micro parts with complex shapes. The main work of this paper is as follows: (1) the main work of this paper is to study the technology of preparing gold micro parts by UV-LIGA. In this paper, the electroforming technology of gold micro parts is studied, and the influence of outlet shape, current density and the distance between cathode and cathode on the surface quality of gold micro parts is studied. The optimized current density and the distance between cathode and cathode are obtained. (2) the overexposure process of SU-8 photoresist was studied, and the influence of overexposure parameters on the surface linewidth of photoresist was analyzed, and the relationship between the overexposure parameters and the shape of photoresist was analyzed. The swelling behavior of SU-8 photoresist in electroforming gold solution was studied, and the swelling law of SU-8 photoresist under substrate constraint was summarized, and the compensation of mask linewidth was analyzed. The effect of reducing the temperature of electroforming and adding the separating belt to improve the dimensional accuracy of gold micro parts. In this paper, the key dimensions of gold micro parts are studied. The overexposure test of SU-8 photoresist is carried out by using the mask with line width compensation, and the adhesive model obtained by overexposure is studied under the effect of swelling. The influence on the side wall of the key part of gold micro parts formed by electroforming.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TH16

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