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泵送剂改善膏体流变性能试验及机理分析

发布时间:2019-06-20 11:10
【摘要】:为改善膏体在进行膏体充填试验时的流动性能,进行泵送剂的试验研究并测试泵送剂的持久性,从膏体絮团结构入手,对泵送剂改善膏体流动性的机理进行分析。研究结果表明:添加泵送剂之后,膏体的屈服应力减小为原来的1/10,黏度降低57%,膏体输送的沿程阻力由59.43 MPa减小为6.20 MPa。0.8 h内膏体的剪切应力只增加4%。膏体内的絮团结构是导致膏体流动性差的主要原因。通过进行显微图像观测,证实泵送剂可破坏膏体絮团结构。泵送剂的主要作用有吸附作用、分散作用、润滑作用,理论分析与试验结果一致。
[Abstract]:In order to improve the flow performance of paste in paste filling test, the experimental study of pumping agent was carried out and the durability of pumping agent was tested. The mechanism of improving paste liquidity by pumping agent was analyzed from the point of view of paste floc structure. The results show that after adding pumping agent, the yield stress of paste decreases to 1 鈮,

本文编号:2503174

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